Packaging structure of wafer layered electromagnetic shielding circuit

Abstract

The invention discloses a packaging structure of a wafer layered electromagnetic shielding circuit, comprising a fixed frame body, a packaging film, a counterweight pressing block, a connection frame, a linkage mechanism and a positioning mechanism. The front of the fixed frame body is provided with an operation cavity, and the fixed frame body The bottom is sleeved with a carrier plate, the upper surface of the carrier plate is provided with a placement slot, the inside of the placement slot is sleeved with a wafer body, the packaging film runs through the bottom of the fixed frame, and the two sides of the counterweight pressing block are in a circular equidistant array Four cutting blades are arranged, a reciprocating mechanism is arranged inside the connection frame, the linkage mechanism is arranged inside the operation cavity, and the positioning mechanism is arranged on the back of the fixed frame body. The beneficial effects of the present invention are as follows: the present invention utilizes the design of the reciprocating mechanism. Under the action of the reciprocating mechanism, the support rod can reciprocate in the vertical direction, and then cooperate with the action of the reset spring, and the reset spring can pull the right pull rope to drive the linkage rotating rod to reverse. Rotate to reverse the cutting blade to cut the packaging film a second time.

Description

technical field [0001] The invention relates to a wafer-level packaging structure, in particular to a packaging structure of wafer layered electromagnetic shielding circuits, belonging to the technical field of semiconductor packaging. Background technique [0002] With the rapid development of electronic components, people tend to miniaturize when producing electronic components, but the distance between miniaturized electronic components is relatively short, so it is often necessary to package electronic components at the wafer level The electromagnetic shielding circuit mechanism is used to eliminate the electromagnetic interference between the electronic components. After the electromagnetic shielding circuit is installed, it needs to be covered with a layer of packaging film to ensure that the electronic components will not interfere with the adjacent Electromagnetic interference occurs in semiconductor materials. [0003] The existing packaging mechanism for wafer-lev...

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Problems solved by technology

[0003] The existing packaging mechanism for wafer-level electromagnetic shielding circuits needs cutting processing when covering the packaging film, but extrusion processing is required when covering the packaging film, so that the packaging film covering and cutting need two operations to be realized. In addition, the packaging film is not extruded from the outside when cutting, so the cutting knife may lift up with the packaging film, which will cause air bubbles between the packaging film and the electromagnetic shielding circuit, and the cutting knife can only clean the packaging film once. Cutting work, and then it is easy to cause insufficient cutting of some packaging films, and often requires secondary cutting work, which indirectly prolongs the packaging process of the electromagnetic shielding circuit

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