Packaging structure of wafer layered electromagnetic shielding circuit

A technology of electromagnetic shielding and packaging structure, which is applied in the direction of circuits, electrical components, metal processing, etc., can solve the problems of insufficient cutting of packaging film, prolong the packaging process of electromagnetic shielding lines, etc., and achieve the effect of sufficient cutting
CN113363168BActive Publication Date: 2022-03-29SHENZHEN SANLIANSHENG SEMICON
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
SHENZHEN SANLIANSHENG SEMICON
Publication Date
2022-03-29

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Abstract

The invention discloses a packaging structure of a wafer layered electromagnetic shielding circuit, comprising a fixed frame body, a packaging film, a counterweight pressing block, a connection frame, a linkage mechanism and a positioning mechanism. The front of the fixed frame body is provided with an operation cavity, and the fixed frame body The bottom is sleeved with a carrier plate, the upper surface of the carrier plate is provided with a placement slot, the inside of the placement slot is sleeved with a wafer body, the packaging film runs through the bottom of the fixed frame, and the two sides of the counterweight pressing block are in a circular equidistant array Four cutting blades are arranged, a reciprocating mechanism is arranged inside the connection frame, the linkage mechanism is arranged inside the operation cavity, and the positioning mechanism is arranged on the back of the fixed frame body. The beneficial effects of the present invention are as follows: the present invention utilizes the design of the reciprocating mechanism. Under the action of the reciprocating mechanism, the support rod can reciprocate in the vertical direction, and then cooperate with the action of the reset spring, and the reset spring can pull the right pull rope to drive the linkage rotating rod to reverse. Rotate to reverse the cutting blade to cut the packaging film a second time.
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Description

technical field

[0001] The invention relates to a wafer-level packaging structure, in particular to a packaging structure of wafer layered electromagnetic shielding circuits, belonging to the technical field of semiconductor packaging. Background technique

[0002] With the rapid development of electronic components, people tend to miniaturize when producing electronic components, but the distance between miniaturized electronic components is relatively short, so it is often necessary to package electronic components at the wafer level The electromagnetic shielding circuit mechanism is used to eliminate the electromagnetic interference between the electronic components. After the electromagnetic shielding circuit is installed, it needs to be covered with a layer of packaging film to ensure that the electronic components will not interfere with the adjacent Electromagnetic interference occurs in semiconductor materials.

[0003] The existing packaging mechanism for wafer-lev...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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