Packaging structure of wafer layered electromagnetic shielding circuit

Abstract

The invention discloses a packaging structure of a wafer layered electromagnetic shielding circuit, and the structure comprises a fixed frame body, a packaging film, a counterweight pressing block, a connecting frame, a linkage mechanism and a positioning mechanism; the front surface of the fixed frame body is provided with an operation cavity, the bottom of the fixed frame body is sleeved with a bearing plate, the upper surface of the bearing plate is provided with a placement groove, and a wafer body is disposed in the placement groove in a sleeved manner; the packaging film penetrates through the bottom of the fixed frame, four cutting blades are annularly arranged on the two sides of the counterweight pressing block at equal intervals in an array mode, a reciprocating mechanism is arranged in the connecting frame, the linkage mechanism is arranged in the operation cavity, and the positioning mechanism is arranged on the back face of the fixed frame. The invention has the beneficial effects that the design of the reciprocating mechanism is utilized, the supporting rod can do reciprocating motion in the vertical direction under the action of the reciprocating mechanism, and the reset spring can pull the right pull rope to drive the linkage rotating rod to rotate reversely under the action of the reset spring, so the cutting blade conducts secondary cutting on the packaging film reversely.

Description

technical field [0001] The invention relates to a wafer-level packaging structure, in particular to a packaging structure of wafer layered electromagnetic shielding circuits, belonging to the technical field of semiconductor packaging. Background technique [0002] With the rapid development of electronic components, people tend to miniaturize when producing electronic components, but the distance between miniaturized electronic components is relatively short, so it is often necessary to package electronic components at the wafer level The electromagnetic shielding circuit mechanism is used to eliminate the electromagnetic interference between the electronic components. After the electromagnetic shielding circuit is installed, it needs to be covered with a layer of packaging film to ensure that the electronic components will not interfere with the adjacent Electromagnetic interference occurs in semiconductor materials. [0003] The existing packaging mechanism for wafer-lev...

AI Technical Summary

Problems solved by technology

[0003] The existing packaging mechanism for wafer-level electromagnetic shielding circuits needs cutting processing when covering the packaging film, but extrusion processing is required when covering the packaging film, so that the packaging film covering and cutting need two operations to be realized. In addition, the packaging film is not extruded from the outside when cutting, so the cutting knife may lift up with the packaging film, which will cause air bubbles between the packaging film and the electromagnetic shielding circuit, and the cutting knife can only clean the packaging film once. Cutting work, and then it is easy to cause insufficient cutting of some packaging films, and often requires secondary cutting work, which indirectly prolongs the packaging process of the electromagnetic shielding circuit

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