High-power LED lamp

A LED lamp, high-power technology, applied in cooling/heating devices of lighting devices, lighting and heating equipment, electrical components, etc., can solve problems such as high energy consumption, slow down heat dissipation efficiency, and increase costs, so as to improve thermal efficiency , expand the application field, avoid the effect of loosening or damage

Inactive Publication Date: 2010-03-10
汪纯燕
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Problems solved by technology

In the above structure, after the substrate (b) encapsulating the LED chip (a) is connected to the refrigerant plate (c) of the heat pipe radiator, thermal resistance occurs at the metal connection interface, and the thermal resistance of the connection interface slows down the heat dissipation efficiency, making the LED The power of the lamp is limited to less than 300W, and consumes a lot of energy, which increases the cost

Method used

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings.

[0014] According to attached figure 2 As shown, the high-power LED lamp described in the present invention is mainly aimed at the high-power LED lamp with centralized packaging and heat pipe radiator (with cooling fins) structure. It includes an LED chip 1 and a heat pipe radiator, and the heat pipe radiator serves as An independent heat dissipation mechanism can conduct the heat generated by the LED chip 1 to the outside to prevent the LED chip 1 from overheating. In the LED lamp with centralized structure involved in the present invention, its heat pipe radiator includes a refrigerant plate 2 and a heat dissipation pipe 3, the heat dissipation pipe 3 is connected to the refrigerant plate 2, and the heat dissipation pipe 3 can be an aluminum pipe, a copper pipe or a stainless steel pipe, At the same time, in order to enhance the heat dissipation effect of the LED la...

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Abstract

The invention discloses a high-power LED lamp. The lamp comprises an LED chip and a heat pipe radiator, wherein the heat pipe radiator comprises a refrigerant plate and a radiating pipe connected on the refrigerant plate; a radiating pipe is filled with refrigerant media and provided with a radiating fin thereon; the LED chip is directly encapsulated on the refrigerant plate; the refrigerant plateis internally cut with a refrigerant storage cavity that is communicated with the radiating pipe and filled with refrigerant media stream; and the refrigerant media in the radiating pipe and the refrigerant media in the refrigerant storage cavity are communicated to form a heat transfer medium, namely a heat emission channel for conducting the heat produced by the LED chip outwards. The heat produced by the LED chip is directly emitted outwards through the heat emission channel in time, thus replacing the connection relation between the refrigerant plate and a base plate of the traditional technology, avoiding the heat resistance of a metal connection section and improving the radiating efficiency of the high-power LED lamp. Besides, the product also has the advantages of strong adaptability, capability of promoting the development of products toward high power and effective reduction of cost.

Description

technical field [0001] The invention relates to the field of LED lamp lighting devices, in particular to a high-power LED lamp adopting a heat pipe cooling method. Background technique [0002] With the advancement of urban lighting projects, high-performance and high-power LED lights are widely used in indoor and outdoor lighting occasions such as roads, buildings, and squares. With the increase of the power of this LED lamp, the calorific value also increases. If the heat emitted by the high-power LED chip in the lamp housing cannot be discharged in time, the high-power LED lamp will not be able to emit light normally. The occurrence of the above phenomenon is mainly due to the fact that the heat generated by the chip of the LED lamp cannot be quickly transferred to the surface of the heat sink, resulting in junction temperature. When the junction temperature exceeds a certain value, the chip will have a large light decay or even burn out , Seriously affect the life of LE...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00H01L23/34H01L23/473F21Y101/02F21K9/20
Inventor 汪纯燕
Owner 汪纯燕
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