64results about How to "Avoid thermal resistance" patented technology

The invention discloses a method for manufacturing a heat sink body. The method aims at solving the problems that in the traditional heat sink manufacturing process, heat resistance is increased due to multilayer welding, and a heat sink body needs to be manufactured through multiple processes and is short in service life. The method includes the steps that three-dimensional modeling is conducted on the whole structure of the heat sink body; a three-dimensional model is guided to a workbench computer, and the printing angle and positions are set according to the structure of a three-dimensional pattern; a powder layer laid on a base plate of a workbench in advance is sintered into two-dimensional shapes corresponding to the powder layer through high-energy laser beams according to the scanning path; powder as thick as the powder layer is laid on the workbench on which one layer of pattern is sintered, and lasers scan the powder according to the scanning path of the layer until the whole three-dimensional pattern is finished. Through the structure, the heat sink body has the advantages that pressure distribution is uniform and the service life of the heat sink body is prolonged.

The invention provides a heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and a preparation method, belonging to the heat dissipation technology of microelectronic devices. The heat dissipation device comprises a low temperature co-fired ceramic substrate with a micro channel embedded inside. Carbon nanotube arrays are prepared on the surface of the low temperature co-fired ceramic substrate and a heating device connected with a circuit of the low temperature co-fired ceramic substrate is fixed on the carbon nanotube arrays. The device makes the most of the advantage that the low temperature co-fired ceramic substrate is easy to be machined into three-dimensional structure, the micro channel is manufactured in the substrate and most heat generated by the heating device is led away through convective heat exchange of the micro channel; and meanwhile, the carbon nanotube arrays and the low temperature co-fired ceramics are closely jointed with the heating device, thus reducing the microvoids generated on the joint interface by the traditional methods such as welding, avoiding heat resistance caused by the microvoids, weakening the heat resistance between the heating device and the low temperature co-fired ceramic substrate and improving the heat dissipation capability of the heat dissipation device.

A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of the insulation substrate. A heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other. The stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink of the heat mass member. The heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters.

The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity.

The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

The present invention is fluid ice making method and apparatus. The method includes cooling the cool carrying medium in fluid to below 0 deg.c with evaporator, spraying ice making water to the cooled cool carrying medium in fluid to form mixed fluid of ice grain and cool carrying medium and separating ice from the cool carrying medium in fluid to obtain fluid ice. The apparatus for making fluid ice includes evaporator, ice making unit, water sprayer, filter with filtering net and circulating pump connected via pipeline. The present invention has high heat efficiency, high practicality, simple structure and low running cost.

The invention provides a method for pyrolysis production of anthracite in a coal powder rotary furnace. The method relates to a coal powder dust removing rotary drying furnace system, an external-heating rotary furnace pyrolysis system with a coal gas circulation function, a rotary cooling passivation system with a heat recovery function, and an oil gas recovering system, wherein the coal powder dust removing rotary drying furnace system is used for heating coal powder to 110 to 280 DEG C and removing coal dust of which the particle size is smaller than 0.2 mm; drying water is recovered and fed to a downstream spiral cooling machine to be used for anthracite cooling and humidification; the coal dust obtained after separation is fed to a coal gas generating system to generate fuel, namely coal gas; after dust removing, coal is sent to a downstream rotary pyrolysis system for pyrolysis; high-temperature anthracite is generated, and cooled; the cooled anthracite is passivated at a middle-low temperature; the passivated anthracite is cooled in the spiral cooling machine; water is sprayed on the cooled passivated anthracite for humidification; the humidified anthracite is sent out; high-temperature oil gas produced in the process enters the oil gas recovering system to obtain coal tar, pyrolyzed water and coal gas. Part of the produced pyrolyzed coal gas returns to the pyrolysis furnace after preheating in a circulating manner, while the other part of the produced pyrolyzed coal gas is sent out.

The invention discloses a luminous device, which comprises the following parts: base, at least one luminous element and insulating layer, wherein the insulating layer is set on the base, which has a pattern exposed out of the base partially; the luminous element is set on the base within the pattern area.

The invention relates to a semiconductor device based on a SiC/diamond composite substrate layer and a preparation method thereof. The preparation method of the semiconductor device comprises steps that a composite substrate layer is prepared, and the composite substrate layer comprises a SiC substrate layer and a diamond layer; an AlN nucleating layer is grown on the Si surface of the SiC substrate layer by using a chemical vapor deposition method; a GaN buffer layer is grown on the AlN nucleating layer by using a chemical vapor deposition method; an AlGaN barrier layer is grown on the GaN buffer layer by using a chemical vapor deposition method. The preparation method is advantaged in that the SiC substrate layer with high quality and the diamond layer with high thermal conductivity arecombined to form the SiC/diamond composite substrate layer structure, and high thermal conductivity of the diamond layer is utilized to improve heat dissipation capability of growing a high-power nitride semiconductor material purely on the SiC substrate layer.

Disclosed is a coaxial wound heat exchanger in the field of heat exchange devices. The coaxial wound heat exchanger comprises a spiral fluted tube, a plurality of capillary tubes and a thermal insulation layer, wherein each capillary tube is wound in a corresponding groove between outer screw threads of the spiral fluted tube; the thermal insulation layer covers the spiral fluted tube and the capillary tubes; the flowing medium in the spiral fluted tube is a refrigerating medium, the flowing media in the capillary tubes are freezing media, and the refrigerating medium and the freezing media flow in a reverse-flow mode. According to the coaxial wound heat exchanger, the size of the heat exchanger can be reduced, and the heat exchange efficiency of the heater exchanger can be improved.

A composite water-cooling radiator structure includes at least a cooling plate, a cooling chip unit and a vapor chamber. The cooling plate has a first upper surface and a first lower surface; a liquid flowing section, through which a first working liquid flows; and an inlet and an outlet communicating with the liquid flowing section. The cooling chip unit is located beneath the cooling plate and has a cold end and a hot end; and the cold end is in contact with the first lower surface of the cooling plate. The vapor chamber is located beneath the cooling chip unit and has a second upper surface and a second lower surface; and the second upper surface is in contact with the hot end of the cooling chip unit. With the superposed cooling plate, cooling chip unit and vapor chamber, the composite water-cooling radiator structure provides good heat dissipation effect.

The invention belongs to the technical field of wireless charging, and discloses a high-thermal-conductivity composite magnetism isolating sheet for a wireless charging receiving end and a preparationmethod of the high-thermal-conductivity composite magnetism isolating sheet. The composite magnetism isolating sheet for the high-thermal-conductivity wireless charging receiving end is a composite material formed by alternately compounding nanocrystalline sheets and a composite material layer, and the composite material layer comprises a thermal conductive filler, a magnetic conductive filler and a binder. According to the preparation method, the surface of the magnetic conductive powder is uniformly coated with the heat conductive powder, so that the electrical conductivity of the magneticpowder can be effectively reduced. And meanwhile, even if the composite magnetic powder has a bridging phenomenon in the composite material layer, the heat conductive powder with excellent insulativity on the surface of the magnetic powder can play a certain role in isolation, so that the resistivity of the composite layer is greatly improved, and the improvement of the charging efficiency of thesystem is facilitated.

The invention relates to a semiconductor device based on a composite substrate and a preparation method thereof. The preparation method comprises steps of selecting a Si substrate layer; growing a diamond layer on a lower surface of the Si substrate layer; growing an AlN nucleating layer on an upper surface of the Si substrate layer; growing a GaN buffer layer on an upper surface of the AlN nucleating layer; and growing an AlGaN barrier layer on an upper surface of the GaN buffer layer. The preparation method is advantaged in that the Si substrate layer with high quality and the diamond layerwith high thermal conductivity are combined to form the Si/diamond composite substrate structure, and high thermal conductivity of the diamond layer is utilized to solve a problem of poor heat dissipation caused by growing a high-power nitride semiconductor material purely on the Si substrate layer.

The invention provides a double-temperature condensing two-stage compressing heat pump system. The double-temperature condensing two-stage compressing heat pump system is characterized by comprising a high pressure stage compressing mechanism, a low pressure stage compressing mechanism, a high temperature stage condensing mechanism, a low-temperature stage condensing mechanism, a high temperature stage evaporation mechanism, a low temperature stage evaporation mechanism, a frictional condensing mechanism, a heat exchanging mechanism, a first throttle mechanism, a second throttle mechanism and a third throttle mechanism; the high pressure stage compressing mechanism, the high temperature stage condensing mechanism, the frictional condensing mechanism, the low temperature stage condensing mechanism, the first throttle mechanism, the low temperature stage evaporation mechanism, the low pressure stage compressing mechanism and the heat exchanging mechanism are sequentially connected to form into a loop; the frictional condensing mechanism is connected with the second throttle mechanism and the third throttle mechanism; the third throttle mechanism is connected with the high pressure stage evaporation mechanism; the high pressure stage evaporation mechanism is connected with the low pressure stage compressing mechanism; the second throttle mechanism is connected with the heat exchanging mechanism. The double-temperature condensing two-stage compressing heat pump system has the advantages of reducing energy loss, improving stability of system operation, meanwhile enabling low temperature heat source in different stages to be used and enabling heat of a low temperature condensing mechanism to be fully used.

A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is defined; a plurality of supports located in the chamber and respectively connected at two opposite ends to the first side and the second side of the main body; a working fluid filled in the chamber; and at least one wick structure layer internally attached to the chamber. The mounting elements respectively define an axial bore and have an end extended through the first side of the main body into the supports to thereby connect to the main body. With these arrangements, the heat dissipation element with the mounting elements connected thereto can tightly contact with a heat-generating element and maintain the chamber in the main body in an airtight state without leakage.

A heat dissipation device with mounting structure includes a main body and a plurality of mounting elements. The main body includes an internally defined chamber having a first side and an opposite second side; a plurality of supports located in the chamber and respectively having two ends connected to the first side and the second side of the chamber; a working fluid filled in the chamber; and a plurality of connection sections in the form of recesses formed on an outer surface of the main body at positions corresponding to the supports in the chamber. The mounting elements are connected to the connection sections. With these arrangements, the heat dissipation device with the mounting elements connected to one outer surface thereof can maintain the chamber in the main body in an airtight state and ensure tight contact of it with a heat-generating element.

The invention discloses a flat plate collector with worm pipes. The flat plate collector comprises a frame; high-light-transmission tempered glass is embedded on the frame; an absorber plate core is arranged below the tempered glass and comprises a heat exchange pipe, heat exchange volutes and heat collecting pipes as many as the heat exchange volutes; each heat collecting pipe comprises a heat collecting runner and heat collecting fins which are integrally formed on the two sides of the heat collecting runner; the heat exchange pipes pass through a plurality of heat exchange volutes; the upper part of each heat collecting runner is communicated with one corresponding heat exchange volute, and the lower part of each heat collecting runner is sealed independently; and the heat exchange pipe, the heat exchange volutes and the heat collecting runners form a closed space which is filled with a heat pipe medium. The flat plate collector has the advantages that as the heat collecting pieces are formed through one-time extrusion, the problems on firmness and heat resistance caused by laser welding or ultrasonic welding are avoided; the defects of frost cracking of a common heat collector in winter and scaling of a pipeline of a common flat plate collector are overcome; and a channel can be formed in each heat collecting runner, and thus the heat transfer effect of the flat plate collector can be improved effectively.

The invention relates to an LED (Light Emitting Diode) light emitting module, which is provided with a bottom plate (1) with at least one groove (2) and at least one printed circuit board (3) with an LED chip (4) array, wherein the at least one printed circuit board (3) is arranged in the groove (2) respectively; the LED light emitting module is characterized in that each LED chip (4) is directly arranged on the printed circuit board (3) by using a COB (Chip On Board) process; and a reflector (5) which is positioned on a side wall of the groove (2) is also arranged to reflect light from the LED chip (4). In addition, the invention also relates to a manufacturing method of the LED light emitting module. According to the LED light emitting module, a polarization effect can be produced, so that the LED light emitting module is particularly suitable for roadway lighting; and the LED light emitting module also has the advantages of simple structure, low cost and small heat resistance.

The invention discloses a heat dissipation device with three-dimensional pulsation heat pipes. The heat dissipation device comprises an evaporation unit, a condensation unit, and a heat insulation unit, wherein a plurality of evaporation pulsation heat pipes and a plurality of condensation pulsation heat pipes are arranged in a plane; one end of each evaporation pulsation heat pipe communicates with one end of the corresponding condensation pulsation heat pipe through a first elbow, and the other end of each evaporation pulsation heat pipe communicates with the other end of the corresponding condensation pulsation heat pipe through a second elbow; and the plurality of evaporation pulsation heat pipes communicate with the plurality of condensation pulsation heat pipes through the pluralityof first elbows and the plurality of second elbows to form a closed-loop passage. According to the heat dissipation device with the three-dimensional pulsation heat pipes, on the basis of existing two-dimensional heat pipes, an evaporation section and a condensation section are arranged on two parallel planes which are parallel to each other, the evaporation section and the condensation section are connected through the elbows to form the closed loop, and the burning-dry phenomenon caused by excessive quantity of the elbows of a traditional heat pipe evaporation section is avoided; and a flat-plate structure can be well connected with a heat source, unnecessary heat resistance is avoided, and heat exchange performance is improved.