Heat dissipation device and manufacturing method thereof

a technology manufacturing method, which is applied in the direction of solid-state devices, metal-working devices, semiconductor devices, etc., can solve the problems of affecting the smooth flow of working fluid, and the inability of heat dissipation device to tightly attach to the heat generation component. , to achieve the effect of avoiding thermal resistance and increasing assembly tightness
US20130098592A1Inactive Publication Date: 2013-04-25ASIA VITAL COMPONENTS SHENZHEN CO LTD
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
ASIA VITAL COMPONENTS SHENZHEN CO LTD
Publication Date
2013-04-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a main body and at least one fixing hole. The main body has a first board body and a second board body corresponding to the first board body. The first and second board bodies are mated with each other to define a chamber. A working fluid and multiple support pillars are disposed in the chamber. At least one capillary structure is disposed on a surface of the chamber. The fixing hole is formed on the main body in a position where any support pillar is positioned. The fixing hole passes through the first and second board bodies and the support pillar. According to the above arrangement, the airtightness of the chamber of the main body can be ensured. Also, the heat spreader can be tightly connected with other components.
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Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates generally to a heat dissipation device and a manufacturing method thereof, and more particularly to a fixing structure for a heat dissipation device. The fixing structure can be disposed on the heat dissipation device without damaging the main body thereof. Accordingly, the working fluid is prevented from leaking out of the chamber of the heat dissipation device so as not to affect heat transfer efficiency of the heat dissipation device.

[0003] 2. Description of the Related Art

[0004] There is a trend to slim the electronic devices. To catch up this trend, the electronic components of the electronic devices must be miniaturized with the electronic devices. While reducing the size of the semiconductors that compose the electronic components, the electronic devices are still required to have advanced performance. In this case, it has become a critical topic how to efficiently dissipate heat gener...

Claims

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