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Manufacturing method of heat radiation device

A technology of heat dissipation device and manufacturing method, which is applied in the directions of manufacturing tools, cooling/ventilation/heating modification, semiconductor/solid-state device manufacturing, etc. lowering rate

Inactive Publication Date: 2006-03-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this structure can make the heat sink and electronic components in flat contact, it is not easy to evenly coat the solder paste on the inner surface of the heat sink groove, and the solder paste is easy to flow after being heated, resulting in gaps between the heat pipe and the heat sink groove. The reduction of the welding area means the reduction of the welding rate, which affects the heat dissipation effect; in addition, the metal sheet also has a certain thermal resistance, so this improvement has not effectively reduced the thermal resistance between the heat pipe, the radiator and the electronic components, and the use of the metal sheet will increase manufacturing cost

Method used

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  • Manufacturing method of heat radiation device
  • Manufacturing method of heat radiation device
  • Manufacturing method of heat radiation device

Examples

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Embodiment Construction

[0012] Please refer to figure 1 and figure 2 , the heat dissipation device of the present invention includes a heat sink 30 and a heat pipe 10, and its manufacturing method comprises the following steps: 1) providing a heat pipe 10; 2) providing a heat sink 30, which includes a base 32, on one side of the base 32 A groove 34 is provided for accommodating the heat pipe 10; a plurality of cooling fins 36 are provided on the other side of the base 32; 3) an electrode 20 such as a tin bar is provided, and the electrode 20 and the heat pipe 10 are placed in the groove in turn. In the groove 34, the welding rod 20 is clamped between the heat pipe 10 and the radiator 30; 4) heating to melt the welding rod 20, and press a plane such as a metal plate to the side where the groove 34 is provided on the base 32, Thus, the heat pipe 10 is fixed in the groove 34 .

[0013] Due to the poor fluidity of the welding rod 20, the gap between the heat pipe 10 and the radiator 30 can be filled a...

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PUM

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Abstract

The invention is a method for manufacturing radiating device, including the following steps of: 1) providing at least a hot tube; 2) providing a radiator, comprising a base, where there is a channel arranged on one side of the base to hold at least a part of the hot tube; 3) providing a welding rod, and in order placing the welding rod, and hot tube in the channel and putting the welding rod in between the hot tube and radiator; 4) heating to melt the welding rod and using a plane to press the channeled side of the base. Because the fluidity of the welding rod is worse, after melted, the welding rod can fill up the gap between the hot tube and radiator, able to avoid the thermal resistance generated because of the air.

Description

【Technical field】 [0001] The invention relates to a method for manufacturing a heat sink, in particular to a method for manufacturing a heat sink applied to electronic components. 【Background technique】 [0002] In order to ensure that the electronic components can work normally, it is necessary to dissipate the heat generated by the electronic components in time. [0003] The combined use of heat pipes and radiators is one of the commonly used heat dissipation methods at present. Usually, the evaporating section of the heat pipe is fixed in the groove at the bottom of the radiator by solder paste welding, so that the evaporating section of the heat pipe is arranged between the radiator and the electronic components, and the condensing section of the heat pipe is extended to the outside, and the condensing section of the heat pipe Several heat sinks are installed outside. When in use, the heat generated by the electronic components can be quickly dissipated through the pha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H05K7/20
CPCB23P2700/10H01L23/427B23K1/0012B23K2201/06B23K2201/14H01L21/4882H01L2924/0002F28D15/0275B23K2101/06B23K2101/14Y10T29/49369Y10T29/49393Y10T29/49353Y10T29/49368Y10T29/49377Y10T29/49373Y10T29/49378H01L2924/00
Inventor 李学坤陈俊吉周世文符猛梁驰
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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