Manufacturing method of heat radiation device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
- Publication Date
- 2006-03-29
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
【Technical field】
[0001] The invention relates to a method for manufacturing a heat sink, in particular to a method for manufacturing a heat sink applied to electronic components. 【Background technique】
[0002] In order to ensure that the electronic components can work normally, it is necessary to dissipate the heat generated by the electronic components in time.
[0003] The combined use of heat pipes and radiators is one of the commonly used heat dissipation methods at present. Usually, the evaporating section of the heat pipe is fixed in the groove at the bottom of the radiator by solder paste welding, so that the evaporating section of the heat pipe is arranged between the radiator and the electronic components, and the condensing section of the heat pipe is extended to the outside, and the condensing section of the heat pipe Several heat sinks are installed outside. When in use, the heat generated by the electronic components can be quickly dissipated through the pha...