Manufacturing method of heat radiation device

A technology of heat dissipation device and manufacturing method, which is applied in the directions of manufacturing tools, cooling/ventilation/heating modification, semiconductor/solid-state device manufacturing, etc. lowering rate
CN1753172AInactive Publication Date: 2006-03-29HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Publication Date
2006-03-29
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention is a method for manufacturing radiating device, including the following steps of: 1) providing at least a hot tube; 2) providing a radiator, comprising a base, where there is a channel arranged on one side of the base to hold at least a part of the hot tube; 3) providing a welding rod, and in order placing the welding rod, and hot tube in the channel and putting the welding rod in between the hot tube and radiator; 4) heating to melt the welding rod and using a plane to press the channeled side of the base. Because the fluidity of the welding rod is worse, after melted, the welding rod can fill up the gap between the hot tube and radiator, able to avoid the thermal resistance generated because of the air.
Need to check novelty before this filing date? Find Prior Art

Description

【Technical field】

[0001] The invention relates to a method for manufacturing a heat sink, in particular to a method for manufacturing a heat sink applied to electronic components. 【Background technique】

[0002] In order to ensure that the electronic components can work normally, it is necessary to dissipate the heat generated by the electronic components in time.

[0003] The combined use of heat pipes and radiators is one of the commonly used heat dissipation methods at present. Usually, the evaporating section of the heat pipe is fixed in the groove at the bottom of the radiator by solder paste welding, so that the evaporating section of the heat pipe is arranged between the radiator and the electronic components, and the condensing section of the heat pipe is extended to the outside, and the condensing section of the heat pipe Several heat sinks are installed outside. When in use, the heat generated by the electronic components can be quickly dissipated through the pha...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More