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Packaging structure of integrated power control unit

A technology of control unit and packaging structure, which is applied in the fields of electrical components, cooling/ventilation/heating transformation, electric solid state devices, etc.

Active Publication Date: 2013-11-27
SHANDONG INST OF ADVANCED TECH CHINESE ACAD OF SCI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, depending on the usage requirements, different functional modules need to be enabled at different times, or the number of functional modules enabled at the same time may be different, resulting in different working conditions of the heating elements on the control unit, resulting in different areas on the control unit. The heat is different, that is, the heat is not uniform
In the case of uneven heat generation, when the heat is dissipated through the traditional water-cooled radiator, the heat dissipation is uneven, and it is easy to have the defect of poor heat dissipation in some areas, and even cause damage to the heating elements in some areas.

Method used

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  • Packaging structure of integrated power control unit
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  • Packaging structure of integrated power control unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a packaging structure of a vehicle-mounted integrated power control unit, including a main substrate 13, on which a plurality of heating elements sharing a bus are distributed, and the heating elements include six electric air-conditioning controller heating elements 2 , 6 DC / DC heating elements 3, 8 vehicle charger heating elements 4 and 6 motor controller heating elements 5, wherein, the electric air conditioner controller heating element 2 realizes the driving function of the vehicle air conditioner, and the DC / DC heating element 3 Realize the shifting function of the car, the heating element 4 of the vehicle charger realizes the charging function of the car, and the heating element 5 of the motor controller realizes the control function of the motor, such as figure 1 As shown, the heating elements that realize the same function are distributed on the main substrate 13 at intervals, for example, the DC / DC heating elements 3 that realize the s...

Embodiment 2

[0042] This embodiment provides a packaging structure of an integrated power control unit, which is an improvement on the basis of Embodiment 1. Compared with Embodiment 1, the integrated power control unit in this embodiment also includes a heat dissipation structure, and the heat dissipation The structure is a heat dissipation shell 1, and the heat dissipation shell 1 is a square shell surrounded by a wall 16, a first side wall 17, a second side wall 18 and a cover plate. In this embodiment, the cover plate is The main substrate 13 of the integrated power control unit, wherein the wall 16, the first side wall 17 and the second side wall 18 are integrally formed into an open groove, and a sealing groove (not shown in the figure) is provided on the edge of the open groove, and the sealing A sealing ring is arranged in the groove, and the edge of the side of the main substrate 13 that is not provided with a heating element is press-fitted with the sealing ring of the sealing gro...

Embodiment 3

[0047] This embodiment provides a packaging structure of an integrated power control unit, which is a modification on the basis of Embodiment 2. Compared with Embodiment 2, the main change is that the structure of the main substrate 13 is changed.

[0048] Such as image 3 As shown, a vacuum cavity 131 is provided inside the main substrate 13, and a liquid phase-change medium 132 is introduced into the interior of the vacuum cavity 131 through a medium inlet 133. The liquid phase-change medium 132 is a new fluorocarbon compound, and the The bottom surface 134 of the vacuum chamber 131 is formed with several capillary grooves (not shown in the figure) that facilitate the uniform distribution of the liquid phase change medium 132. The cross-sectional shape of the capillary grooves is triangular. Of course, the capillary grooves The cross-sectional shape can also be trapezoidal or rectangular.

[0049] When the integrated power control unit is working, the heat is transmitted fr...

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Abstract

The invention provides a packaging structure of an integrated power control unit. Heating elements are not distributed according to a traditional functional module. All the heating elements are distributed in a scattered mode. The problems of the use conditions, power and the like of the heating elements achieving the same function and different functions are comprehensively considered, the heating elements achieving the same function are distributed on a main substrate at intervals, the heating elements achieving the different functions are also distributed on the main substrate at the same time, and therefore under the different use conditions, the heating quantities of different areas on the whole main substrate are even to the great extent. On the one hand, even heating provides the powerful guarantee for even heat dissipation, on the other hand, the simplification of the integrated heat dissipation structure is facilitated, and then the packaging structure is beneficial to meeting the small-size requirement of the control unit. Meanwhile, the even heating is also beneficial to improving the use stability of the main substrate and prolonging the service life of the main substrate.

Description

technical field [0001] The invention relates to a novel packaging structure of an integrated power control unit, belonging to the technical field of packaging of integrated power control units. Background technique [0002] Excessive temperature will affect the performance of the integrated power control unit, and even cause irreversible damage to power devices, affecting the normal use of components. The 10°C rule states that when the device temperature is lowered by 10°C, the reliability of the device will double. Therefore, from the perspective of improving the reliability of power devices, how to reduce the temperature of power devices, especially the temperature of integrated power control units with multiple heating elements has become a research hotspot in various countries. [0003] The traditional main idea of ​​reducing the temperature of the integrated power control unit is to dissipate the heat generated by the functional modules of the integrated power control...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/31H05K7/20
Inventor 徐国卿刘玢玢李卫民梁嘉宁林桂林常明
Owner SHANDONG INST OF ADVANCED TECH CHINESE ACAD OF SCI CO LTD
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