Leadframe configuration to enable strip testing of sot-23 packages and the like

A technology of SOT23 and lead frame, which is applied in the field of lead frame configuration to realize the strip test of SOT-23 package, etc., and can solve the problems of increased package stress, lack of flow guide strip test, etc.

Inactive Publication Date: 2010-03-10
MICROCHIP TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Lack of diversion bars has made strip testing impossible for SOT-23 packages and packages like it, and adding two diversion bars results in increased package stress and unreliability during molding compound flow and / or trimming / forming nature, which has not yet been resolved

Method used

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  • Leadframe configuration to enable strip testing of sot-23 packages and the like
  • Leadframe configuration to enable strip testing of sot-23 packages and the like
  • Leadframe configuration to enable strip testing of sot-23 packages and the like

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Embodiment Construction

[0013] Reference is now made to the drawings, which schematically illustrate details of certain example embodiments. Identical elements in the drawings will be denoted by the same number, and similar elements will be denoted by the same number with a different lowercase letter suffix.

[0014] Referring to FIG. 1 , there is depicted a prior art leadframe strip comprising a plurality of SOT-23 packaged integrated circuit devices before and after isolation of the signal leads (e.g., pins) of each of the integrated circuit devices from the leadframe. Schematic floor plan. Leadframe strip 100 includes a stamped or etched pattern of leadframe 101 . Each of the lead frames 101 includes signal and / or power leads 104 (three-, five-, and six-lead SOT23 devices), signal leads 108 (five- and six-lead SOT23 devices), signal leads 106 (six-lead SOT23 devices), common (eg ground or Vss) lead 110 and integrated circuit die pad 102 . During fabrication of the SOT23 integrated circuit packa...

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PUM

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Abstract

A reduced width tie bar and a common lead hold a die paddle of each integrated circuit SOT-23 package to a leadframe within a strip of leadframes after isolating signal leads from the leadframe. Striptesting of most devices in the SOT-23 lead packages may then be performed. The common lead may be at the center of an edge of the SOT-23 package. Also the common lead may be any one of the leads of the SOT-23 package. The reduced width tie bar may be downstream of the epoxy encapsulation flow for better package integrity.

Description

technical field [0001] The present invention relates to SOT-23 three-, five-, and six-lead integrated circuit packages, etc., which, after isolation of the signal leads from the leadframe, remain to a common-lead leadframe and each die attached to the corresponding leadframe. Connection of a reduced width busbar to a die pad such as a leadframe strip, and more particularly to the one common lead and providing a stable platform and sufficient support to enable highly parallel leadframes to integrated circuit packages The strip test then removes the integrated circuit package from the leadframe strip with the reduced width diverter bars of each of the respective leadframes removed from the leadframe strip. Background technique [0002] Strip testing of integrated circuit packages greatly enhances the ability to test integrated circuits simultaneously in parallel in their packages by testing many integrated circuits while they are still in their assembled leadframe strips. The...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L21/60
CPCH01L2924/14H01L23/49541H01L23/49562H01L24/49H01L2224/49171H01L2224/48257H01L2924/00014H01L24/48H01L2224/45099H01L2224/45015H01L2924/207
Inventor郎孙·纪唐龙贾尼特·亚拉帕特
OwnerMICROCHIP TECH INC