Surge protector

Abstract

The invention relates to a surge protector in which a semiconductor chip and electrodes are electrically connected by full area. In an insulation casing, a wiring terminal, a conductive connecting line, an electrode, a semiconductor chip, an electrode, a mechanical thermal trip device, an indication window mechanism, a conductive connecting line and a wiring terminal are electrically connected sequentially. Conductive solidification liquid is injected and filled into cracks and clearances generated after conductive faces at both sides of the semiconductor chip and the planes of the two electrodes of the surge protector are welded and connected electrically, and becomes a conductive body in the cracks and the clearances of the semiconductor chip and the electrodes after being solidified, so that the aim that the conductive full section of the semiconductor chip in the surge protector participates in electrical connection is achieved.

Description

Technical field [0001] The invention relates to a process for electrically connecting semiconductor chips and electrodes of a surge protector, in particular to a surge protector capable of full-area electrical connection between semiconductors and electrodes. Background technique [0002] At present, the structure of the known surge protector is composed of an insulating shell, terminal blocks, conductive connecting wires, electrodes, semiconductor chips, mechanical thermal release devices, indicating windows and installation fixtures. Its working principle is to be installed between the phase wire and the ground wire, the neutral wire and the ground wire of the power distribution system respectively. When a high-voltage surge wave appears in the power distribution system and reaches the point where the semiconductor chip is turned on, the high resistance of the chip itself drops sharply so that it becomes a conductor and discharges to the ground. At this time, the voltage d...

AI Technical Summary

Problems solved by technology

However, when the semiconductor chip of the surge protector is electrically connected to the full cross-section of the electrode, reflow soldering, tin soldering, and chemical fusion welding are mostly used, so that there will be cracks in the semiconductor chip caused by cooling and contraction of the soldering place between the semiconductor chip and the electrode after welding, and also There will be a gap between the semiconductor chip and the flat electrode due to insufficient solder flow

Generally, the above method is used for welding the semiconductor chip and the flat electrode of the surge protector. Due to the above cracks and gaps in the welding process between the semiconductor chip and the electrode, a part of the cross-section of one semiconductor chip cannot work normally or does not work, while the other part of the semiconductor The chip is overloaded, resulting in reduced lifespan or burnt semiconductor chips

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