Unlock instant, AI-driven research and patent intelligence for your innovation.

LED packaging module

A technology of LED packaging and LED chips, which is applied to lighting devices, components of lighting devices, lighting and heating equipment, etc. It can solve the problems of weakening light intensity, restricting the popularization and application of LED lighting technology, and uneven and soft light.

Inactive Publication Date: 2010-04-07
DONGGUAN WANFENG NANOMETER MATERIALS
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the above-mentioned existing technologies still have deficiencies, which restrict the popularization and application of LED lighting technology.
Although the above-mentioned prior art adopts the secondary optical processing technology, it only controls the direction of light output, and does not introduce diffusion and enhancement components from the LED bulb to the entire LED lighting device. Then, the result of the secondary optical processing is to improve The direction of the light output, but the intensity of the light output is weakened, and the light is uneven and not soft enough

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED packaging module
  • LED packaging module
  • LED packaging module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings. refer to figure 1 , figure 2 , the first embodiment of the present invention is an LED packaging module, including a substrate 101 and an LED chip 110; the substrate 101 is an AlSi alloy material, wherein the content of Al is 30%-95%, and the content of Si is 5%- 70%; the substrate 101 has a crystal-bonding surface 1011 and a wiring surface 1012, the crystal-bonding surface 1011 is arranged parallel to the wiring surface 1012, the height of the crystal-bonding surface 1011 is lower than the wiring surface 1012, and the A reflective surface 1013 is provided between the crystal bonding surface 1011 and the wiring surface 1012; a reflective film 102 is provided on the surface of the crystal bonding surface 1011, the wiring surface 1012, and the reflective surface 1013, and the reflective The film structure of the film 102 is Ni-Ag-Ni; the thickness of each laye...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to LED package used for illuminating. An LED packaging module comprises a substrate and an LED chip. The substrate is provided with a die bonding surface and a wiring surface. The die bonding surface and the wiring surface are arranged in parallel. The die bonding surface is lower than the wiring surface. A reflection transitional surface is arranged between the die bonding surface and the wiring surface. The LED chip is arranged on the die bonding surface. The LED packaging module also comprises a diffusion and brightness enhancement layer which is filled in the space defined by the die bonding surface and the reflection transitional surface. The diffusion and brightness enhancement layer is positioned above the heat sink layer and coats the LED chip inside. The top surface of the diffusion and brightness enhancement layer is higher than that of the LED chip. The diffusion and brightness enhancement layer is the mixture of transparent silica gel and glass microspheres. The LED packaging module has the functions of diffusion and brightness enhancement and has uniform and soft emergent light.

Description

technical field [0001] The invention relates to an LED package for lighting. Background technique [0002] Compared with traditional lighting devices, LED street lights not only have the characteristics of good chromaticity, maintenance-free, and long life, but more importantly, they are more energy-efficient than traditional street lights. [0003] Chinese invention patent documents CN101101103, CN101101102, and CN101101107 respectively disclose a LED street lamp, the heat dissipation performance of which has reached a practical level. The above three kinds of LED street lamps represent the mainstream of LED lighting technology on the market, including tunnel lights and indoor lighting, and their core technologies are very similar to those disclosed in the above patent documents. The above-mentioned technologies all use an aluminum substrate with a printed circuit, set a plurality of single LED bulbs on the aluminum substrate, and then attach a radiator to the back of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V7/00F21V7/22F21V5/08H01L25/075H01L33/00F21Y101/02F21K9/00F21Y115/10
Inventor 李金明
Owner DONGGUAN WANFENG NANOMETER MATERIALS