LED encapsulating structure and method thereof

Abstract

The invention discloses an LED encapsulating structure and a method thereof. The encapsulating structure comprises a bracket, an LED wafer, a wire, transparent external encapsulating glue and external encapsulating glue in which a dispersant is added, wherein the transparent external encapsulating glue is in up-and-down hierarchical connection with the external encapsulating glue in which the dispersant is added; the bracket comprises two parallel electrodes; the end surface of one end of the electrodes is provided with a groove supporting seat; the LED wafer is fixed on the bottom of the groove supporting seat by primer; the wire is connected with the LED wafer and the electrodes; the transparent external encapsulating glue is used for coating the LED wafer, the wire and the part of the bracket where the groove supporting seat is located; the transparent external encapsulating glue is higher than the groove supporting seat and is used for coating the LED wafer; the external encapsulating glue in which the dispersant is added is lower than the groove supporting seat, wherein the dispersant is distributed on the external encapsulating glue in which the dispersant is added; and no dispersant is distributed on the transparent external encapsulating glue. By adopting the encapsulating structure, good spot and uniform illumination of the light emitted by an LED are realized without reducing the brightness.

Description

technical field [0001] The invention relates to the technical field of light-emitting diodes (LEDs), in particular to a light-emitting diode packaging structure and a method thereof. Background technique [0002] As a light source, light-emitting diodes have the advantages of long service life, high brightness, and low power consumption, so they can be widely used in lighting lamps, displays, indicator lights, and automobile brake lights. [0003] The light-emitting diodes of the existing transparent models include: the positive and negative electrode brackets have a groove above one pole for accommodating the light-emitting chip, and are connected to the chip with welding wires to form a path; The outside of the bracket is poured with glue through a mold to form a required shape, thereby forming a light-emitting diode that can emit light of various colors. [0004] Because the outer sealant is packaged with transparent glue, this advantage is: the brightness of the light-e...

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Problems solved by technology

[0004] Because the outer sealant is packaged with transparent glue, this advantage is: the brightness of the light-emitting diode is high; the disadvantage is: uneven light emission, uneven light emission, poor light spots, and poor display effects in practical applications (such as figure 1 shown)

[0005] The common way in the prior art to solve the above-mentioned technical problems is to use an external sealing structure with a diffusing agent. The advantages of this solution are: uniform light emission and better light spots; the disadvantage is that the luminous brightness is reduced

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