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Improved LED packaging method and packaging structure

A technology of LED encapsulation and encapsulation method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as high cost and complicated operation, and achieve low cost, broad application prospects, and the effect of improving luminous brightness and heat dissipation performance

Active Publication Date: 2016-02-03
FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these solutions also have defects such as complicated operation and high cost.

Method used

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  • Improved LED packaging method and packaging structure
  • Improved LED packaging method and packaging structure
  • Improved LED packaging method and packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] The LED packaging method of Example 1 includes: injecting the mixture of phosphor powder and organic silica gel into the chip holder that has completed the crystal bonding and gold wire binding by dispensing, completing the phosphor powder coating on the surface of the LED chip, and then heating the LED chip at temperature Stand in an environment of 60°C for 2 hours (this operation can be done on a heating platform), and finally cure at a temperature of 150°C for 4 hours.

[0085] The LED packaging methods of Examples 2 and 3 are basically the same, including: injecting the mixture of phosphor powder and organic silica gel into the chip holder that has completed the crystal bonding and gold wire binding by dispensing, and completing the phosphor powder coating on the surface of the LED chip. Cover, then let it stand for 2 hours in an environment with a temperature of 60°C (this operation can be done on a heating platform), then let it stand for 1 hour in an environment w...

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Abstract

The invention discloses an improved LED packaging method and packaging structure. The packaging method comprises the following steps: 1, coating the surface of an LED chip with phosphor and a liquid-state organic silica gel composition after the phosphor and the liquid-state organic silica gel composition are well mixed; 2, placing the LED chip processed in step one under the condition of a first temperature for heating so as to realize deposition of the phosphor, wherein the firs temperature is greater than a room temperature and smaller than a crosslinking temperature of the organic silica gel composition; and 3, placing the LED chip processed in step two under a heating and / or illumination condition to enable the organic silica gel composition to be solidified. According to the invention, LED packaging can be rapidly and simply realized at a low cost, conformal deposition of the phosphor on the surface of the LED chip can be realized in a packaging process under the condition that less phosphor is consumed, the light emitting quality of an LED device is substantially improved (for instance, light is emitted more uniformly, light spots are basically free from blue-circle and yellow-circle phenomena, and the like), and the luminescence brightness and the heat dissipation performance of the LED device can also be effectively improved. Therefore, the application prospect is wide.

Description

technical field [0001] The invention particularly relates to an improved LED packaging method and packaging structure. Background technique [0002] In recent years, semiconductor light-emitting elements, especially white LEDs, which have the characteristics of long life and low power consumption, have been widely used as light sources. The current mainstream white light LED is realized by adding phosphor powder to the blue light chip (PhosphorConverted). The packaging method is to coat the yellow YAG phosphor powder on the blue light LED chip. Yellow light of 550nm is emitted. After the yellow light is mixed with unabsorbed blue light, the human eye can recognize it as white light through the principle of color mixing. In addition, some multicolor phosphors are also widely used. [0003] The mainstream LED packaging process mainly includes processes such as die bonding, wire bonding, phosphor coating, lens molding, and testing and sorting. Among them, phosphor coating is...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/56H01L33/64
CPCH01L33/48H01L33/50H01L33/56H01L33/64H01L33/644H01L2933/0041H01L2933/005
Inventor 张汝志
Owner FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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