Improved LED packaging method and packaging structure

A technology of LED encapsulation and encapsulation method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as high cost and complicated operation, and achieve low cost, broad application prospects, and the effect of improving luminous brightness and heat dissipation performance

Active Publication Date: 2016-02-03
FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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  • Improved LED packaging method and packaging structure
  • Improved LED packaging method and packaging structure
  • Improved LED packaging method and packaging structure

Examples

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Example Embodiment

[0084] The LED packaging method of Embodiment 1 includes: injecting a mixture of phosphor powder and organic silica gel into a chip holder that has completed solid crystal bonding and gold wire binding by dispensing to complete the phosphor coating on the surface of the LED chip. It is allowed to stand for 2h in an environment of 60℃ (this operation can be completed on a heating platform), and finally cured at a temperature of 150℃ for 4h.

[0085] The LED packaging methods of Examples 2 and 3 are basically the same, including: injecting a mixture of phosphor powder and organic silica gel into the chip holder that has completed solid crystal bonding and gold wire binding by dispensing to complete the phosphor coating on the surface of the LED chip Cover, then stand for 2h in an environment with a temperature of 60℃ (this operation can be completed on a heating platform), then stand for 1h in an environment with a temperature of 100℃, and finally put it at a temperature of 150℃ for...

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Abstract

The invention discloses an improved LED packaging method and packaging structure. The packaging method comprises the following steps: 1, coating the surface of an LED chip with phosphor and a liquid-state organic silica gel composition after the phosphor and the liquid-state organic silica gel composition are well mixed; 2, placing the LED chip processed in step one under the condition of a first temperature for heating so as to realize deposition of the phosphor, wherein the firs temperature is greater than a room temperature and smaller than a crosslinking temperature of the organic silica gel composition; and 3, placing the LED chip processed in step two under a heating and/or illumination condition to enable the organic silica gel composition to be solidified. According to the invention, LED packaging can be rapidly and simply realized at a low cost, conformal deposition of the phosphor on the surface of the LED chip can be realized in a packaging process under the condition that less phosphor is consumed, the light emitting quality of an LED device is substantially improved (for instance, light is emitted more uniformly, light spots are basically free from blue-circle and yellow-circle phenomena, and the like), and the luminescence brightness and the heat dissipation performance of the LED device can also be effectively improved. Therefore, the application prospect is wide.

Description

technical field [0001] The invention particularly relates to an improved LED packaging method and packaging structure. Background technique [0002] In recent years, semiconductor light-emitting elements, especially white LEDs, which have the characteristics of long life and low power consumption, have been widely used as light sources. The current mainstream white light LED is realized by adding phosphor powder to the blue light chip (PhosphorConverted). The packaging method is to coat the yellow YAG phosphor powder on the blue light LED chip. Yellow light of 550nm is emitted. After the yellow light is mixed with unabsorbed blue light, the human eye can recognize it as white light through the principle of color mixing. In addition, some multicolor phosphors are also widely used. [0003] The mainstream LED packaging process mainly includes processes such as die bonding, wire bonding, phosphor coating, lens molding, and testing and sorting. Among them, phosphor coating is...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48H01L33/50H01L33/56H01L33/64
CPCH01L33/48H01L33/50H01L33/56H01L33/64H01L33/644H01L2933/0041H01L2933/005
Inventor 张汝志
Owner FLORY OPTOELECTRONICS MATERIALS SUZHOU CO LTD
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