Selective immersion process of PCB

A PCB board and selective technology, applied in the field of selective gold process, can solve the problems of complicated process and high production cost of gold process, and achieve the effect of convenient fading, low production cost and good promotion value

Inactive Publication Date: 2010-04-14
惠州市协昌电子有限公司
View PDF0 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention aims to solve the problems of complex process and high production cost in the gold chemical process, and then provide a new selective gold chemical process technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In order to facilitate the understanding of those skilled in the art, the present invention will be described in further detail below in conjunction with specific embodiments:

[0018] The selective gold chemical process is as follows: PCB surface cleaning → ink screen printing on the first side of the PCB board → baking board → ink screen printing on the second side of the PCB board → baking board → gold chemical → film removal.

[0019] Before cleaning the surface of the PCB board, preparations need to be done, that is, making a screen plate. The process of making a screen plate includes stretching the screen and designing the screen graphics. The stretching of the net is to tighten the net yarn on the screen frame to make the screen, which is an important link before the screen printing work. Adjust the mesh stretch angle to 22.5° to form a certain angle to ensure that the lines parallel to the screen frame can be printed accurately. At the same time, in order to en...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a low-cost selective immersion process which is applicable to a PCB (printed circuit board). The process comprises: 1) surface cleaning of the PCB; 2) a first-side ink silk screen printing of the PCB; 3) baking board; 4) a second-side ink silk screen printing of the PCB; 5) baking board; 6) immersion; and 7) stripping; hereinto, the ink in processes 2) and 4) adopts Aurosit2149HS ink and 77T silk screen printing. The invention adopts novel and low-cost thermal curing type ink to replace the dry film or blue plastic which is widely used in the existing industry, adopts the way of silk screen ink to implement the selective covering of the PCB surface and only needs short-time thermal curing process after silk screen. The selective immersion process has the advantages of simple flow, convenient operation, and low production cost, and is easy to realize the selective covering of the PCB with small welding spot space. Simultaneously, the ink causes less pollution to the gold nickel cylinder of an immersion line and is convenient for the stripping.

Description

technical field [0001] The invention relates to a PCB board goldization process, in particular to a low-cost selective goldization process suitable for PCB printed circuit boards. Background technique [0002] In the PCB manufacturing industry, in order to ensure that the pads (PADs) or circuits on the PCB have good solderability, conductivity and oxidation resistance, it is often required to plated precious metals such as gold or nickel on the surface of the PAD or circuit. There are usually two processes in the industry: one is gold electroplating, that is, the PCB board is used as a cathode, and gold ions are discharged on the surface of the PCB board under the action of direct current to form a gold electroplating layer; the second is chemical gold, that is, chemical gold plating, The PCB board of this process does not require an external power supply, and only relies on the plating solution to carry out a chemical reduction reaction, so that metal ions are continuously ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/24
Inventor 周刚
Owner 惠州市协昌电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap