Photosensitive resin composition, photosensitive resin mixture and a corresponding printed circuit board

A technology of photosensitive resin and composition, applied in the field of printed circuit board and photosensitive resin composition, can solve the problems of insufficient resolution performance, insufficient resist adhesion and the like

Active Publication Date: 2020-10-23
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the prior art, U.S. Patent No. 3,622,334 discloses photopolymerizable compositions containing heterocyclic nitrogen compounds. When these compositions are used, the penetration of etching solutions into the copper-clad laminate metal surface and the corrosion resistance The bending of the line is improved, but the adhesion of the resist to the ferrous base mate

Method used

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  • Photosensitive resin composition, photosensitive resin mixture and a corresponding printed circuit board
  • Photosensitive resin composition, photosensitive resin mixture and a corresponding printed circuit board
  • Photosensitive resin composition, photosensitive resin mixture and a corresponding printed circuit board

Examples

Experimental program
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Effect test

Embodiment

[0056] 1. Synthesis of alkali-soluble polymer resin

[0057] Prepared by free radical solution polymerization, comprising the following steps:

[0058] Mix methacrylic acid, methyl methacrylate, butyl acrylate, styrene and hydroxyethyl methacrylate according to the mass ratio of 21 / 37 / 30 / 6 / 6, add initiator AIBN 0.5g, control The amount of solvent methyl ethyl ketone is configured as a mixed solution with a solid content of 37wt%, stirred and dissolved, and a mixed solution with a mass fraction of about 35% is added to a three-necked flask protected by nitrogen and equipped with a condensation reflux device through a peristaltic pump, and the oil bath is heated to 80 ℃, stirred for 1 hour, then slowly added the remaining mixed solution dropwise, and the addition was completed within 3 hours. After continuing the heat preservation reaction for 4 hours, the temperature was raised to 90°C, and 20 g of methyl ethyl ketone solution dissolved with 0.2 g of the initiator was added tw...

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Abstract

The invention relates to a photosensitive resin composition, a photosensitive resin mixture and a corresponding printed circuit board, and belongs to the technical field of preparation of circuit printed elements. The photosensitive resin composition comprises, by weight, 46-70% of alkali-soluble copolymer resin, 26-45% of an ethylenically photopolymerizable unsaturated monomer, 1-5% of a photopolymerization initiator, 0.2-3% of polydopamine particles, 0.5-1% of a coloring agent and 0.01-0.1% of an additive. A photosensitive dry film resist DFR prepared from the composition has especially excellent high adhesion and resist stripping performance, and also has the advantages of excellent analytical performance, high film stripping speed and good film breakage morphology, the application range of the DFR is widened, and the production efficiency and yield of the PCB are improved.

Description

technical field [0001] The invention relates to the technical field of preparation of circuit printed components, in particular to a photosensitive resin composition, a mixture and a corresponding printed circuit board. Background technique [0002] In recent years, so-called dry film resists (hereinafter abbreviated as DFR) having a structure in which a photopolymerizable resin layer is sandwiched between support films have been widely used as photoresists for manufacturing printed wiring boards and processing metal substrates agent. Such a photopolymerizable layer is usually of an alkali-developable type using a weak alkaline aqueous solution as a developing solution. [0003] When using DFR to make printed circuit boards, the process generally includes film attachment, lamination, exposure, and development to form a resist pattern on the substrate. In the process of processing printed circuit boards and metal substrates, one of the particularly important characteristics...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004H05K3/06
CPCG03F7/027G03F7/004H05K3/064
Inventor 朱薛妍李伟杰李志强傅明
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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