Photosensitive resin composition, photosensitive resin mixture and a corresponding printed circuit board

Abstract

The invention relates to a photosensitive resin composition, a photosensitive resin mixture and a corresponding printed circuit board, and belongs to the technical field of preparation of circuit printed elements. The photosensitive resin composition comprises, by weight, 46-70% of alkali-soluble copolymer resin, 26-45% of an ethylenically photopolymerizable unsaturated monomer, 1-5% of a photopolymerization initiator, 0.2-3% of polydopamine particles, 0.5-1% of a coloring agent and 0.01-0.1% of an additive. A photosensitive dry film resist DFR prepared from the composition has especially excellent high adhesion and resist stripping performance, and also has the advantages of excellent analytical performance, high film stripping speed and good film breakage morphology, the application range of the DFR is widened, and the production efficiency and yield of the PCB are improved.

Description

technical field [0001] The invention relates to the technical field of preparation of circuit printed components, in particular to a photosensitive resin composition, a mixture and a corresponding printed circuit board. Background technique [0002] In recent years, so-called dry film resists (hereinafter abbreviated as DFR) having a structure in which a photopolymerizable resin layer is sandwiched between support films have been widely used as photoresists for manufacturing printed wiring boards and processing metal substrates agent. Such a photopolymerizable layer is usually of an alkali-developable type using a weak alkaline aqueous solution as a developing solution. [0003] When using DFR to make printed circuit boards, the process generally includes film attachment, lamination, exposure, and development to form a resist pattern on the substrate. In the process of processing printed circuit boards and metal substrates, one of the particularly important characteristics...

AI Technical Summary

Problems solved by technology

[0005] In the prior art, U.S. Patent No. 3,622,334 discloses photopolymerizable compositions containing heterocyclic nitrogen compounds. When these compositions are used, the penetration of etching solutions into the copper-clad laminate metal surface and the corrosion resistance The bending of the line is improved, but the adhesion of the resist to the ferrous base material such as 42 alloy / 36 alloy is still insufficient, and after development, the cured resist bends and peels off, and, at high temperature During the etch process, peeling and lifting of the cured resist can easily occur

[0006] In another prior art, Japanese Patent No. 63-184744 discloses a photopolymerized laminate, which still has the defect of insufficient resolution

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