Palladium-plated bonded copper wire and production method thereof

A technology for bonding copper wires and a manufacturing method, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, electrical solid-state devices, etc., and can solve the problems of poor high temperature stability, easy surface oxidation, low hardness of electroplating layer and inability to resist friction, etc.

Inactive Publication Date: 2010-05-12
NINGBO KANGQIANG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the defects and deficiencies of existing alloy bonding copper wires, such as easy oxidation on the surface, poor high temperature stability, high production cost of gold-plated bonding copper wires, low hardness of the electroplating layer and no resistance to f

Method used

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  • Palladium-plated bonded copper wire and production method thereof
  • Palladium-plated bonded copper wire and production method thereof
  • Palladium-plated bonded copper wire and production method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0023] ① Extraction of high-purity copper: Dilute the copper nitrate solution with high-purity water at a ratio of 1:4 to prepare an electrolyte; use the national standard No. 1 pure copper as the anode to immerse in the electrolyte, and ensure that 95% of the volume ratio of pure copper is immersed in the electrolysis liquid; use high-purity copper foil as the cathode to immerse in the electrolyte, and also ensure that 95% of the volume ratio of high-purity copper foil is immersed in the electrolyte; input a direct current of 7-9V, 2.5-3.5A between the anode and the cathode, Maintain the temperature of the electrolyte not exceeding 60°C by replenishing fresh electrolyte; when the cathode accumulates high-purity copper with a purity greater than 99.9995%, replace the high-purity copper foil in time, and then clean and dry it for later use.

[0024] ②Preparation of single crystal copper rods: In a continuous casting room for horizontal continuous casting of metal single crystals...

Embodiment 2

[0033] Step 1. to step 4. are the same as in Embodiment 1.

[0034] ⑤Palladium plating on the surface: Apply conventional electroplating equipment and technology to the annealed Copper wire electroplating pure palladium anti-oxidation protective layer, the purity of palladium used for electroplating is required to be greater than 99.999%; the current density is 4-4.5A / dm 2 , the speed of copper wire is 4-5m / min, and the thickness of the coating is controlled at 3μm; the copper wire product after palladium plating is 8.92g / cm according to the density of pure copper 3 , The density of pure palladium is 12.0g / cm 3 In conversion, it can be known that the weight percentage of palladium is 8.19%, and the rest is copper.

[0035] ⑥Precise drawing: using conventional precision drawing equipment and technology, the aforementioned pure palladium anti-oxidation protective layer is electroplated The copper wire is precision drawn through multi-pass process palladium-coated copper bon...

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Abstract

The invention discloses a bonded copper wire product which uses high-purity copper wires as a matrix and is coated with a pure-palladium protective layer on the surface thereof. According to weight percentage, the bonded copper wire product contains 1.35 percent to 8.19 percent of palladium and the balance of copper; the production method of the palladium-plated bonded copper wire comprises the following steps: extraction of high-purity copper, preparation of a single-crystal copper bar, coarse drawing, heat treatment, palladium plating on the surface, fine drawing, heat treatment, surface cleaning and shunt winding. The invention abandons the traditional backward technique of application directly after drawing firstly and then electroplating, and adopts the technique that firstly, copper wires with diameter of less than 1mm are produced, then the pure-palladium layer is electroplated, and finally, the palladium-plated bonded copper wire finished product is produced by fine drawing. The bonded copper wire product can effectively improve the oxidation resistance of the bonded copper wires, ensure that the appearance of the finished product keeps silver metallic luster, and greatly prolong the quality guarantee period of the bonded copper wire product after being sealed off; in addition, the mechanical strength of the finished product is strengthened and the oxidation resistance thereof is improved, thus being beneficial to reducing the wire diameter of the bonded copper wire, shortening welding spacing and being more applicable to packaging of high-density and multi-pin integrated circuits.

Description

technical field [0001] The invention relates to the technical field of metal bonding wire products used in the subsequent packaging process of microelectronics, in particular to a palladium-plated surface structure of bonding copper wires and a manufacturing method thereof. Background technique [0002] The bonding process of microelectronic device chips refers to welding the two ends of the bonding wire to the chip pads and lead frame pins respectively by ultrasonic pressure at a certain temperature to realize the connection between the internal circuit of the chip and the external circuit. Early bonding wires were mostly made of pure gold, but with the increasing scarcity of gold resources and rising prices, the cost of microelectronic packaging has risen sharply. Therefore, people in the industry have successfully developed copper wire products to replace expensive gold wire products. , such typical products as ZL200610154487.4 authorized and announced by the State Intell...

Claims

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Application Information

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IPC IPC(8): H01L23/49H01L21/60
CPCH01L2924/20751H01L2224/45015H01L2924/01046H01L2924/20753H01L2924/01047H01L2924/01079H01L2224/43H01L2224/45565H01L2924/20752H01L24/45H01L2924/01033H01L2924/01006H01L2924/20754H01L2924/01029H01L24/43H01L2224/45664H01L2924/01078H01L2224/45144H01L2224/45147H01L2224/4321H01L2224/43848H01L2224/45H01L2924/00011H01L2924/00014H01L2924/14H01L2924/01205H01L2924/00H01L2224/48H01L2924/20108H01L2924/20109H01L2924/00012H01L2924/01204
Inventor 郑康定冯小龙李彩莲
Owner NINGBO KANGQIANG ELECTRONICS CO LTD
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