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Contamination prevention system, lithographic apparatus, radiation source, and method for manufacturing a device

A lithography equipment and radiation source technology, applied in microlithography exposure equipment, optomechanical equipment, semiconductor/solid-state device manufacturing, etc., can solve problems such as pollution prevention system failure, pollution prevention system balance sensitivity, pollution prevention system vibration, etc.

Inactive Publication Date: 2010-05-26
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the pollution prevention system is oversized to collect radiation at a larger source collection angle, the pollution prevention system will heat up and cause failure of the pollution prevention system
High thermal loads and high rotational speeds cause the pollution prevention system to be sensitive to balance and vibrations in the pollution prevention system, thereby increasing the chance of breakage

Method used

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  • Contamination prevention system, lithographic apparatus, radiation source, and method for manufacturing a device
  • Contamination prevention system, lithographic apparatus, radiation source, and method for manufacturing a device
  • Contamination prevention system, lithographic apparatus, radiation source, and method for manufacturing a device

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Embodiment Construction

[0024] figure 1 A lithographic apparatus according to an embodiment of the present invention is schematically shown. The lithographic apparatus includes: an irradiation system (illuminator) IL, which is configured to adjust a radiation beam B (for example, ultraviolet (UV) radiation or extreme ultraviolet (EUV) radiation); a support structure (for example, a mask table) MT, It is configured to support the patterning device (such as a mask) MA and is connected to a first positioning device PM for accurately positioning the patterning device according to determined parameters; a substrate table (such as a wafer table) WT is configured to Used to hold a substrate (for example, a resist coated wafer) W, and is connected to a second positioning device PW configured to accurately position the substrate W according to determined parameters; and a projection system (for example, a refractive projection lens System) PS, which is configured to project the pattern imparted by the patterni...

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Abstract

A contamination prevention system is constructed and arranged to prevent material from propagating with radiation into a lithographic apparatus. The contamination prevention system includes a rotatable carrier provided with a plurality of generally radially outwardly extending blades. The blades are constructed and arranged to absorb or deflect the material. The system also includes a stationary shaft, and a bearing constructed and arranged to rotate the rotatable carrier and the blades around the shaft. The rotatable carrier is provided with a space for at least partially receiving a portion of the shaft.

Description

Technical field [0001] The invention relates to a pollution prevention system, a lithographic projection equipment, a radiation source and a method of manufacturing a device. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment can be used in the manufacture of integrated circuits (ICs). In this case, a patterning device optionally called a mask or a reticle can be used to generate a circuit pattern to be formed on a single layer of the IC. The pattern can be transferred to a target portion (e.g., including a portion of a die, one or more die) on a substrate (e.g., a silicon wafer). Generally, the transfer of the pattern is performed by imaging the pattern onto a layer of radiation sensitive material (resist) provided on the substrate. Typically, a single substrate will contain a network of adjacent target portions that are continuously p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20
CPCG03F7/709G03F7/70916G03F7/70925H01L21/0275
Inventor E·J·布斯C·A·霍根达姆A·M·斯卓克肯A·C·瓦辛克E·T·M·白吉拉尔特P·P·A·A·布洛姆
Owner ASML NETHERLANDS BV