Method for producing circuit board by filling resin in holes on inner core plate
A technology of inner layer core board and resin plug hole, which is used in printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problem that the inner layer core board is easily deformed, the copper on the inner layer core board surface is easily worn, and the scrap rate is high. problem, to achieve the effect of strong bonding, energy saving and time saving
Inactive Publication Date: 2012-06-06
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
[0003] The technical problem solved by the present invention is: to overcome the technical problems of the prior art that the resin plug hole is polished by the traditional method, the inner core board is easily deformed, and the copper on the surface of the inner core board is easily worn, resulting in a high scrap rate
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[0018] The technical solutions of the present invention will be further described below in conjunction with specific embodiments.
[0019] Such as figure 1 As shown, the specific implementation mode of the present invention is: provide a kind of circuit board manufacturing method of inner layer core plate resin plug hole, comprise the steps:
[0020] Step 100: Copperizing the inner core board of the circuit board. In the circuit board manufacturing process, the copperization of the inner layer core board of the circuit board includes sinking copper and electroplating copper. In the present invention, after the inner layer core board is drilled, the inner layer core board needs to be processed by the procedure of sinking copper. The role of copper sinking on the inner core board is to deposit a uniform conductive layer on the hole wall through the redox reaction of the non-metallic holes on the inner core board. After the inner core board is subjected to copper sinking treatm...
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The invention relates to a method for producing a circuit board by filling resin in holes on an inner core plate, comprising the following steps: copperizing the inner core plate; producing the circuit of the inner core plate; browning the surface of the inner core plate; filling resin in holes on the inner core plate; and flattening the resin on the inner core plate. The holes on the inner core plate are filled with the resin after the circuit of the inner core plate is produced and the surface of the inner core plate is browned, thus the holes on the inner core plate can be copperized sufficiently, and the production process is more convenient to control. The holes on the inner core plate do not need to be polished after being filled with the resin, thus the inner core plate can not be deformed due to the polishing, the copper on the holes can not be damaged and the rejection rate of the inner core plate can be kept low. After the holes on the inner core plate are filled with the resin, the resin is solidified without using a baking plate, and the resin is flattened at the time of pressing the inner core plate, thus the time and the energy are saved. The surface of the inner core plate is browned before the holes on the inner core plate are filled with the resin, thus the resin in the holes and the copper on the holes can be bonded more tightly.
Description
technical field [0001] The invention relates to a method for manufacturing a circuit board with a resin plug hole, in particular to a method for manufacturing a circuit board with a resin plug hole for an inner core board. Background technique [0002] The traditional circuit board manufacturing method of resin plug holes in the inner core board usually adopts copperization of the inner core board holes, then resin plugs the holes, bakes the board to cure the resin, and then grinds the inner core board surface by grinding. The excess resin is used to make the circuit of the inner core board, and then browned and then pressed. In the prior art, this method is usually used for the production of circuit boards with resin plug holes in the inner core board. In these methods, the step of resin plugging is placed before the inner layer core board circuit making and browning process. The production process is inconvenient to control. The copper on the surface of the inner core boa...
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IPC IPC(8): H05K3/00
Inventor 刘东叶应才
Owner SHENZHEN SUNTAK MULTILAYER PCB