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Method and device for dispatching mechanical hand and plasma processing equipment

A scheduling method and technology of a scheduling device are applied in the field of ions, which can solve the problems affecting the working efficiency of plasma processing equipment, low film transfer efficiency of a manipulator, affecting machine productivity, etc., so as to shorten the time required for the process and quickly perform the transmission operation. , the effect of fast scheduling

Active Publication Date: 2012-04-11
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In fact, when the above method is used for film transmission, there is still a problem that the film transmission speed needs to be further improved. For example, if figure 1 In the state of the plasma processing equipment shown in the figure, it is necessary to carry out the film transfer operation on the chamber module 1, and both arm A and arm B are in an idle state, then the system may choose arm A when randomly selecting the arm, in this case , because the arm A is relatively far away from the chamber module 1, so its rotation angle to the chamber module 1 is larger than the rotation angle required by the arm B to rotate to the chamber module 1, so that the above-mentioned rotation of the arm A needs to experience more Long time, which leads to low efficiency of manipulator film transfer in the whole process, and ultimately affects the working efficiency of the entire plasma processing equipment, thereby affecting the productivity of the machine

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  • Method and device for dispatching mechanical hand and plasma processing equipment
  • Method and device for dispatching mechanical hand and plasma processing equipment
  • Method and device for dispatching mechanical hand and plasma processing equipment

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Embodiment Construction

[0024]In order to enable those skilled in the art to better understand the technical solution of the present invention, the manipulator scheduling method / device provided by the present invention and the plasma processing equipment using the method and / or device will be described in detail below with reference to the accompanying drawings.

[0025] For ease of explanation, several terms and defined variables used in the present invention are first explained.

[0026] The position mentioned in the present invention refers to the possible position of the arm when the manipulator intends to carry out the transmission operation. Based on this, the current position of the arm refers to the position corresponding to the current position of the arm. In order to facilitate the calculation and description later, the variable Cur_Stn is set to represent the current position of the arm; the target position refers to the destination to which the arm is to be moved. The location of the grou...

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Abstract

The invention discloses a method for dispatching a mechanical hand. The method comprises the following steps of: selecting an arm closest to a target position according to the quantity of idle arms, a current arm position Cur-Stn and a target position M-Stn; and rotating the selected arm to the target position, so that the arm performs transfer operation at the target position. Besides, the invention also discloses a device for dispatching the mechanical hand and plasma processing equipment applying the method and / or the device for dispatching the mechanical hand. Rapid dispatch and rapid transfer operation of the mechanical hand can be realized, so the time needed by the entire process can be shortened and the yield of equipment can be enhanced.

Description

technical field [0001] The invention relates to the technical fields of mechanical transmission and plasma, in particular to a manipulator scheduling method, device and plasma processing equipment. Background technique [0002] Currently, in the field of plasma technology, in order to obtain a higher return on investment, plasma processing equipment is required to have a higher productivity. Existing plasma processing equipment typically includes wafer cassettes, a transport device such as a robot arm, chamber modules, and a wafer aligner. Usually, the wafer is taken out of the wafer cassette by a robot, and placed into the target chamber module according to the process requirements, so that subsequent operations can be performed there. In the actual process, a workpiece such as a wafer to be processed can visit different chamber modules to complete different operations, and after these processes are completed, the wafer is taken out of the chamber module by the robot and p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/00B25J3/00B25J9/16
Inventor 马宝林
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD