Packaging method for combining telescopic screw with printed circuit board

Abstract

The invention relates to a ppackaging method for combining a telescopic screw with a printed circuit board, which comprises the following steps: pressing a screw head of the telescopic screw comprising the screw head, a screw rod and a sleeve with a fixture to prop the screw head at one end of the sleeve, extend a part of the screw rod out of the sleeve and fix the fixture outside the sleeve, providing the printed circuit board provided with a plurality of perforations and a solder layer; contacting the fixture with a tool to take the telescopic screw to make the screw rod correspond to the perforations of the printed circuit board; allowing the tool to release the fixture to make the fixture and the telescopic screw fall down, and cooperating flanges of the sleeve with the solder layer to limit the flanges in the perforations; and after the solder layer is hardened to fix the sleeve, removing the fixture to combine the telescopic screw with the printed circuit board. The package method achieves the effect of precisely and easily arranging the sleeve of the telescopic screw without shift and deflection.

Description

technical field [0001] The invention relates to a packaging method for combining a sleeve screw with a printed circuit board, in particular to a sleeve screw that can be set accurately, without deviation, without skew and easy to set. A packaging method that is screw-bonded to a printed circuit board. Background technique [0002] Figure 1 to Figure 5 Respectively, the illustration of the socket screw Figure 1 , indicating Figure II , Schematic representation of existing conventional encapsulation methods Figure 1 , indicating Figure II and signal Figure three Generally, when the sleeve screw is combined with the printed circuit board, a sleeve screw 5 with a screw head 51, a screw rod 52 and a sleeve 53 is used, and the sleeve 53 of the sleeve screw 5 corresponds to a printed circuit board. On the perforation 71 of the circuit board 7, press down the screw head 51 again, so that the sleeve 53 of the sleeve screw 5 has a serrated flange 531 pressed in the perforat...

AI Technical Summary

Problems solved by technology

[0003] Although the above-mentioned existing conventional method can combine the sleeve screw 5 in the perforation 71 of the printed circuit board 7, the sleeve screw 5 directly corresponds to the perforation 71 with its sleeve 53 when setting, and its screw head 51 and the sleeve 53 It cannot be compressed and fixed, so it needs to be placed manually, and the volume of the sleeve screw 5 and the hole diameter of the perforation 71 are small. Due to errors in manual placement, the flange 531 of the sleeve 53 cannot be aligned with the perforation 71 smoothly, resulting in poor pressing of the printed circuit board and damage to the board, and when the flange 531 of the sleeve 53 cannot be placed on the perforation 71 at one time , often due to the inaccurate plane precision of the printed circuit board 7, when the flange 531 of the sleeve 53 is set in the perforation 71, it cannot be completely pressed into the perforation 71, and it is easy to have deviation and skew.

In addition, it is necessary to press each sleeve screw 5 to assemble the sleeve screw 5 by pressing, so it is impossible to optimize the efficiency of assembling the sleeve screw 5 by using the surface adhesion technology widely used in the industry.

[0004] It can be seen that the above-mentioned existing packaging method of combining the sleeve screw with the printed circuit board obviously still has inconvenience and defects in method and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general method has no suitable method to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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