Method for peeling rigid board from flexible board area of flexible-rigid board

Abstract

The invention discloses a method for peeling a rigid board from a flexible board area of a flexible-rigid board. The method mainly comprises the following steps of: pressing a flexible board on at least one inner rigid board and allowing part of the flexible board to expose outside to form the flexible board area; and further pressing at least one outer rigid board on the multi-layer structure by another pressing step, wherein the outer rigid board comprises a dielectric layer and a copper sheet, the boundary, corresponding to the flexible board area, of the dielectric layer is punched to form a slot prior to the pressing, and the dielectric layer, at the position of the flexible board area, is peeled along the slot to expose the flexible board after the pressing is carried out and a circuit is formed on the copper sheet. The rigid board part, to be removed, on the flexible-rigid board can be removed through simple mechanical actions by the technology; and thus, the problems of long time and large workload which are caused by process procedures such as laser cutting, exposing and developing, etching, film removing and the like of the traditional technology are solved.

Description

technical field [0001] The invention relates to a soft and hard board process method, in particular to a method for peeling off a hard board on a soft board area of ​​a soft and hard board. Background technique [0002] In order to reduce the volume of electronic products, the relevant facilities must cooperate accordingly, and the circuit board as the main component is even more duty-bound. In this case, flexible and rigid boards that can be flexed to further reduce the occupied space emerge as the times require. Generally, rigid and flexible boards have a multi-layer structure. The manufacturing method is roughly as follows: [0003] See first Figure 7 As shown, a soft board 60 and two inner hard boards 70 are mainly pressed together through a pressing step, wherein the soft board 60 is roughly formed with a circuit 62 on the surface and bottom of a soft substrate 61, and the two hard boards 70 are respectively A copper skin 72 is provided on the opposite outer surface o...

AI Technical Summary

Problems solved by technology

[0006] Although the above-mentioned production process can be used to manufacture flexible soft and hard boards, the final removal of the hard board structure in the soft board area is too complicated and expensive. high suspicion

The reason is that: using laser cutting to remove the hard plate structure, in addition to making a laser barrier in advance in the multi-layer structure, and after the laser cutting is completed, the laser barrier 64 must be etched and removed through an etching process, and then it must be laminated. , exposure, development, etching and film removal, etc., in order to completely remove the laser blocking pad remaining on the soft and hard board, the steps are complicated and the implementation cost is high

[0007] From the above, it can be seen that the method of removing the hard board structure in the soft board area in the traditional soft board production process has the disadvantages of complicated implementation steps and high cost, which needs further review and seek feasible solutions

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