Method for repairing circuits of embedded circuit board

A circuit board and circuit technology, used in printed circuit components, secondary processing of printed circuits, metal pattern materials, etc., can solve problems such as open circuit, circuit short circuit, and waste of embedded circuit board production costs, so as to reduce waste, Avoid the effect of overflow

Inactive Publication Date: 2010-06-16
UNIMICRON TECH CORP
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] When the electroplating process is performed on the metal layer to form a circuit layer with traces or when the metal carrier board is reverse-pressed on the film, the traces have defects due to process variation or other factors, and this defect may cause the circuit. Electrical

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for repairing circuits of embedded circuit board
  • Method for repairing circuits of embedded circuit board
  • Method for repairing circuits of embedded circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Figure 1A to Figure 1B Is a schematic cross-sectional view of a method for repairing a circuit of an embedded circuit board according to an embodiment of the present invention, Figure 1C For patching Figure 1B An enlarged schematic view of the top view of the local circuit of the embedded circuit board. Please refer first Figure 1A According to the repair method of the embedded circuit board of this embodiment, first, an embedded circuit board 100 is provided. The embedded circuit board 100 includes a dielectric layer 110 and a plurality of circuits 120a-120c ( Figure 1A Only three are schematically shown in the figure), where the dielectric layer 110 has a surface 112 and an engraved pattern 114, the lines 120a-120c are located in the engraved pattern 114 of the dielectric layer 110, and the line 120c has a defect 122a.

[0039] It is worth mentioning that the structure of the embedded circuit board 100 may have only a single circuit layer or multiple circuit layers....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Line widthaaaaaaaaaa
Login to view more

Abstract

The invention relates to a method for repairing circuits of an embedded circuit board, which comprises the following steps of: firstly providing an embedded circuit board, wherein the embedded circuit board comprises a dielectric layer and a plurality of circuits, the dielectric layer is provided with a surface and a notched pattern, and the circuits are positioned in the notched pattern, the partial circuits are provided with at least one defect; and then, spray printing a conductive fluid material on the defects in a spray printing mode to repair the circuits.

Description

technical field [0001] The present invention relates to a circuit repair method, and in particular to a circuit repair method of an embedded circuit board. Background technique [0002] Today's circuit board technology has developed from a common non-embedded circuit board to an embedded circuit board. In detail, the characteristic of the common non-embedded circuit board is that the circuit protrudes from the surface of the dielectric layer, while the feature of the embedded circuit board is that the circuit is embedded in the dielectric layer. [0003] A conventional process for wiring an embedded circuit board includes the following steps. Firstly, a substrate with a metal layer and a metal carrier is provided. Next, a photoresist layer is coated on the metal layer. Then, exposing and developing the photoresist layer to form a patterned photoresist layer. Then, an electroplating process is performed on the metal layer to form a circuit layer, wherein the circuit layer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K3/22H05K3/10H05K1/09
Inventor 曾子章陈俊谦
Owner UNIMICRON TECH CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap