Manufacturing method of multi-layered circuit board

Abstract

The invention relates to a manufacturing method of a multi-layered circuit board, comprising the following steps: employing laser direct drilling (LDD) technique coupled with electro-plating etching technology for manufacturing the multi-layered circuit board; and finishing manufacturing interlayer via holes and fine lines in the process of manufacturing the multi-layered circuit board. With the manufacturing method adopted, the high cost ultrathin copper sheet pressing technology is not adopted yet the advantage of facilitating manufacturing of the fine lines by the technology is enjoyed.

Description

technical field [0001] The invention relates to a manufacturing method of a multilayer circuit board, in particular to a multilayer circuit board manufacturing process capable of simultaneously completing interlayer via holes and fine lines. Background technique [0002] The current multilayer circuit board manufacturing method is as follows: [0003] First provide a substrate 70 (such as Figure 8 shown), the substrate 70 is made of PP material; [0004] A copper skin 71 is respectively pressed on the upper and lower surfaces of the base material 70; [0005] Then form the drill hole 72 on the substrate 70 that has pressed the copper skin 71 (as Figure 9 shown), followed by a via hole process, so that the copper skin 71 on the upper and lower surfaces of the substrate 70 can be conducted. The through-hole process utilizes the through-hole electroplating technology to plate a copper layer 73 on the wall of the drilled hole 72 and the surface of the upper and lower layers...

AI Technical Summary

Problems solved by technology

[0007] The aforementioned method is suitable for making multi-layer continuous stacked conductive line structures, but it is not conducive to making thin lines

The reason is that when making thin lines, the thinner the etched copper thickness, the better. If the etched copper thickness is too thick, it is easy to cause changes in line shape, impedance, line width spacing and other conditions, and the thin line width spacing has reached the limit. However, The aforementioned multi-layer circuit board manufacturing process electroplates the copper layer 73 on the laminated copper skin 71, so that the copper thickness to be etched when making the circuit becomes very thick (> 20um), so it is not conducive to making multiple circuits with thin circuits. multi-layer circuit board; if it is necessary to make thin lines, chemical copper or another method of pressing ultra-thin copper skin must be used, and these methods require expensive materials and equipment costs, which are not economical

[0008] From the above, it can be seen that the existing multi-layer circuit board manufacturing process is not suitable for making thin lines. If it is necessary to make copper lines, it must use expensive chemical copper or laminated ultra-thin copper, which is not beneficial.

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