Single component organic silicon packaging glue cured by ultraviolet for high-power LED

An ultraviolet, one-component technology, applied in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problems of epoxy resin curing speed, heat resistance, high temperature yellowing, light transmission stability, and heat dissipation. Indicators and other issues to achieve the effect of improving light transmittance, convenient use, and reducing light decay
CN101747860BInactive Publication Date: 2012-10-17陈俊光
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
陈俊光
Publication Date
2012-10-17
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a single component organic silicon packaging glue cured by ultraviolet for high-power LED and a preparation method thereof. The packaging glue is prepared by mixing a prepolymer component A containing acrylate polysiloxanes, a monomer component B containing acrylate polysiloxanes, a photosensitizer component C and a tackifier component D. The packaging glues obtained withdifferent refractive indexes such as level 1.4, level 1.5 and the like are used for packaging multiple types of high-power LEDs or encapsulation of other optical purposes. By adopting ultraviolet curing, the invention enhances the packaging efficiency of the high-power LED product to a great extend without influencing the temperature tolerance, the discoloration and the light transmittance of theproduct.
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Description

technical field

[0001] The invention relates to an ultraviolet curing single-component organic silicon encapsulant for high-power LEDs and a preparation method thereof. technical background

[0002] Ultra-brightness light-emitting diode (LIGHE EMITTING DIODE referred to as LED) is a kind of electroluminescent solid-state device. Compared with traditional incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps, LEDs have the advantages of very small operating current, no environmental pollution, simple structure, high brightness, small size, and long service life. Especially the successful development of white LED, high-power LED production has become a fact. In a short time, the main body of the fourth-generation light source will be formed.

[0003] It can be seen from the structure of the LED illuminant that the LED chip is bonded to the matrix material and connected to the external electrodes through the lead. Then, the potting glue is used to con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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