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Internal opening full flow convex pot mouth

A spout and flow technology, which is applied in the field of full-flow convex spout with internal opening, can solve the problems of low work efficiency, unsuitable for large-scale batch processing, and easy formation of virtual welding of joints, so as to ensure adequacy and safety. The effect of firmness

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Internal opening full flow convex pot mouth
  • Internal opening full flow convex pot mouth
  • Internal opening full flow convex pot mouth

Examples

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Embodiment Construction

[0012] Such as figure 1 The one shown is a full-flow convex spout with inner opening, which is composed of four rectangular spouts to form a "mountain" character structure, and a tin overflow groove 2 is opened in the middle. The edge of the slot 2 is provided with a tin overflow port 1 . The tin overflow opening 1 is a rectangular opening with a depth of 3-6 mm.

[0013] Such as figure 2 As shown, there are electronic components 3 that need to be shielded and welded on the PCBA board 4 on the periphery of the combined spout, and a tin overflow port 1 is provided at the junction of adjacent spouts and the edge of the overflow tin groove 2, which is very good Lead the tin liquid into the overflow tin tank 2 in a safe manner, so that the tin liquid overflowing from the pot mouth overflows from the tin overflow port 1 and then gathers in the overflow tin tank 2 and returns to the tin furnace without overflowing tin from the outside of the pot mouth And the electronic componen...

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Abstract

The invention relates to a solder pot component used for tin soldering of a PCBA board, in particular to an internal opening full flow convex pot mouth. Four rectangle pot mouths are spliced into an inverted m structure; the middle part is provided with a tin overflow tank, each joint of every two adjacent pot mouths and the edge of the tin overflow tank are provided with tin overflow openings; and the tin overflow openings are rectangle openings and have a depth of between 3 and 6mm. The internal opening full flow convex pot mouth has simple structure, can effectively improve the soldering efficiency, is suitable for large-scale automation production, and also effectively prevents an oxide layer on the surface layer of the tin liquor from leaving on the surface of the PCBA board to guarantee the quality of the soldering joint.

Description

technical field [0001] The invention relates to a tin furnace component used for PCBA board soldering, in particular to an inner-opening full-flow convex-shaped pot spout. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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