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Sheet type spout for avoidance of grounding block element

A technology of grounding blocks and spouts, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as low work efficiency, easy formation of joints, unsuitable for large-scale batch processing, etc., to ensure sufficiency and firmness Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Sheet type spout for avoidance of grounding block element
  • Sheet type spout for avoidance of grounding block element
  • Sheet type spout for avoidance of grounding block element

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Embodiment Construction

[0013] Such as figure 1 The shown grounding block element avoids a flake-shaped spout. At least one tin overflow opening 1 is provided on the edge of the spout. The tin overflow opening is a rectangular opening with a depth of 3-4mm. The side wall of the spout is recessed to form an escape ring 2 for accommodating the grounding block, and a rectangular tin overflow hole 3 is opened on the outer wall of the spout below the escape ring 2 .

[0014] Such as figure 2 As shown, the grounding block 4 is located in the avoidance ring 2, and the cooperation between the avoidance groove 2 and the grounding block 4 plays a role in positioning the installation position of the spout, ensuring the accuracy of the welding position. By opening the overflow tin hole 3 on the outer wall of the spout below the avoidance ring 2, the tin liquid gushing out from the spout will flow out of the overflow hole 3 in advance before reaching the spout and contacting the PCBA board 6, so that the tin li...

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Abstract

The invention relates to a component of a soldering furnace for tin soldering of a PCBA board, in particular to a sheet type spout for avoidance of a grounding block element for welding a computer motherboard. The edge of the spout is provided with at least one tin overflow port, the tin overflow port is a rectangular opening and is 3-4mm deep; the side wall of the spout is concave inwards to form an avoidance ring for accommodating a grounding block, and the outer wall of the spout below the avoidance ring is provided with a rectangular tin overflow hole. The invention has simple structure, can effectively improve the welding efficiency, and is applicable to large-scale automated production. In addition, the invention can effectively prevent the oxide layer on the tin liquid surface from being left on the surface of the PCBA board, thereby ensuring the quality of the welding joint.

Description

technical field [0001] The invention relates to a tin furnace part used for PCBA board soldering, in particular to a sheet-shaped spout of a grounding block element used for welding a computer main board. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical compo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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