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Tin-overflowing pot having flange on side walls

A technology of overflowing tin and pot opening, which is applied in the direction of assembling printed circuits with electrical components, etc., can solve the problems of low work efficiency, unsuitable for large-scale batch processing, and easy formation of virtual soldering of contacts, so as to ensure adequacy and firmness. Effect

Inactive Publication Date: 2010-06-30
SUZHOU MINGFU AUTOMATIC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the shortcomings of the above-mentioned various solders, especially when automatic selective point-to-point wave soldering is used to weld PCBA boards with dense solder joints, the work efficiency is low, it is not suitable for large-scale batch processing, and the joints are easy to form virtual soldering. The invention provides a tin furnace spout with simple structure, which can effectively improve welding efficiency and ensure the quality of welding joints

Method used

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  • Tin-overflowing pot having flange on side walls
  • Tin-overflowing pot having flange on side walls
  • Tin-overflowing pot having flange on side walls

Examples

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Effect test

Embodiment Construction

[0012] like figure 1 Shown is a tin overflow spout with ribs on the side. The spout is a semi-enclosed structure, and an avoidance groove 3 is formed in the middle. A tin overflow spout 1 is provided on the edge of the spout. A rib 2 is arranged in the front, and the side wall of the spout of the lower end of the rib 2 is fixedly connected. The tin overflow opening 1 is a rectangular gap with a depth of 3-6 mm, and the tin overflow hole 2 is a rectangular hole.

[0013] like figure 2 As shown, some electronic components 4 that need solder-free protection are located in the avoidance groove 3, and there are electronic components 3 on the PCBA board 5 on the periphery of the pot mouth of the tin overflow port 1, and the ribs arranged outside the tin overflow port 1 are used. 2. Restrict the outward diffusion path of the tin liquid, and use the baffle 2 to perform soldering shielding on the peripheral electronic components 4 .

[0014] When in use, place the PCBA board at a p...

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Abstract

The invention relates to a tin furnace parts used for PCBA plate soldering tin, in particular to a tin-overflowing pot having a flange on side walls. The pot has a semi-circling structure; an avoiding slot is formed on the middle part; a tin-overflowing opening is arranged on the edge of the pot; the flange is arranged in front of the tin-overflowing opening; the lower end of the flange is fixedly connected with the side wall of the pot; the tin-overflowing opening is a rectangular opening, the depth of which is ranged between 3 and 6 mm; and a tin-overflowing hole is a rectangular hole. The invention has simple structure, can efficiently promote the welding efficiency, is fit for large-scale automatic production, efficiently prevents the oxide layer on the tin liquid surface from remaining on the surface of the PCBA plate and ensures the welding quality.

Description

technical field [0001] The invention relates to a tin furnace part used for PCBA board soldering, in particular to a tin overflow pot spout with ribs on the side. Background technique [0002] The usual wave soldering is usually manually operated, and the production efficiency is relatively low. For PCBA boards that require dense soldering points, this soldering method is even more insufficient. In addition, because the tin outlet is too small (generally 2 mm long), it will bring Tin slag blocks the mouth of the pot, which leads to a large area of ​​false soldering; for PCBA boards with denser solder joints, there are also pot mouth structures, but the usual tin furnace pot mouth is designed as a flat mouth, in order to realize PCBA board Soldering operation generally needs to keep a distance between the PCBA board and the spout. On the one hand, it is ensured that the tin liquid sprayed from the spout can solder the electrical components on the PCBA board above, and at the ...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 庄春明
Owner SUZHOU MINGFU AUTOMATIC SCI & TECH
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