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On-line measuring method of Poisson ratio of micro-electromechanical system (MEMS) film based on resonance frequency method

A technology of resonance frequency and measurement method, which is applied in the analysis of solids using sonic/ultrasonic/infrasonic waves, which can solve the problems of complex operation, need, and inapplicability to online measurement.

Active Publication Date: 2011-06-15
常熟紫金知识产权服务有限公司
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  • Application Information

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Problems solved by technology

This method is a direct measurement based on the definition of Poisson's ratio, which has high precision, but the operation is complicated and requires expensive equipment such as an atomic force microscope, so it is not suitable for on-line measurement

Method used

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  • On-line measuring method of Poisson ratio of micro-electromechanical system (MEMS) film based on resonance frequency method
  • On-line measuring method of Poisson ratio of micro-electromechanical system (MEMS) film based on resonance frequency method
  • On-line measuring method of Poisson ratio of micro-electromechanical system (MEMS) film based on resonance frequency method

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Embodiment

[0100] Such as( Figure 6-1 ), in the silicon sacrificial layer process, a layer of 0.3 μm thick silicon dioxide (sio 2 ) layer 2, and then deposited a layer of 0.2 μm thick silicon nitride layer 3 ( Figure 6-1 ), and then deposit a layer of phosphosilicate glass with a thickness of 2 μm as a sacrificial layer 4 ( Figure 6-2 ), after gluing, exposing and developing, etch a circular cavity 5 with a radius of 200 microns on the sacrificial layer 4 with HF solution ( Figure 6-3 ), and then deposit a layer of 2 μm thick polysilicon thin film as the structure layer 6 (6-4), on the structure layer with the anchor region as the center, etch a circular disc 7 with an outer radius of 400 μm ( Figure 6-5 ), remove the sacrificial layer with HF solution to get the desired structure ( Figure 6-6 ). Use the MSA-500 microscopic laser vibrometer to measure the resonant frequency f of radial vibration 1 = 1.0650E07 Hz and the resonant frequency f of the transverse vibration 2 = 6.3...

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Abstract

The invention discloses an on-line measuring method of the Poisson ratio of a micro-electromechanical system (MEMS) film based on a resonance frequency method. The method comprises the following steps of: making an annular MEMS film as a testing structure, fixedly supporting the inner boundary of the MEMS film on an anchor zone and enabling the outer boundary of the MEMS film to be free; fixing the anchor zone on a substrate; measuring the resonance frequency of the radial vibration and the transverse vibration of the annular MEMS film; and calculating the Poisson ratio of the MEMS film by using the resonance frequency of the radial vibration and the transverse vibration. In the method, the concrete values of Young modulus, material density and the like of the film are not needed to be known in advance, thereby errors caused by the Young modulus, material density and the like can be avoided, and the precision is improved. Due to the symmetrical structure of the annular film, the fixedsupporting in the anchor zone more approaches to the ideal state. The measuring method belongs to non-contact measurement so that the measuring process can not influence the testing structure, and the repeatability of the measurement can be ensured. The measuring method is suitable for both a conductor and a non-conductor, and the testing structure is simple to make.

Description

Technical field: [0001] The invention provides a method capable of measuring the Poisson's ratio of a microelectromechanical system (MEMS) film on-line, and belongs to the technical field of MEMS material parameter measurement. technical background: [0002] MEMS thin films are widely used in microelectromechanical systems. The quality of the mechanical properties of the film has a great influence on the performance of the device, especially the performance of the structural layer film of the movable part is very important to the success or failure of the MEMS device production and the quality of the performance. The mechanical parameters of MEMS films mainly include Poisson's ratio, elastic modulus, residual stress, and stress gradient along the thickness direction. The mechanical properties of the thin film will be very different from those of the same macroscopic bulk material, and the mechanical properties of the macroscopic bulky material cannot be equated with the mec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/12
Inventor 戎华赵彩峰
Owner 常熟紫金知识产权服务有限公司
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