Reflective type high-power light-emitting diode (LED) packaging structure

An LED packaging and high-power technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of reducing the brightness of LED lighting, reducing the utilization rate of LED lighting, and achieving the effects of simple structure, improved service life, and high thermal conductivity.

Inactive Publication Date: 2010-07-07
王海军
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When LED illuminates, the light emitted by the LED light source will diverge to the surroundings, and some of the light emitted by t

Method used

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  • Reflective type high-power light-emitting diode (LED) packaging structure
  • Reflective type high-power light-emitting diode (LED) packaging structure

Examples

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Example Embodiment

[0014] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0015] like figure 1 As shown: the present invention includes a reflective substrate 1 , a reflective groove 2 , an LED light-emitting chip 3 , a focusing lens 4 , silica gel 5 , a fixing bracket 6 , a conductive electrode 7 and a conductive pin 8 .

[0016] like figure 1 As shown: the LED light-emitting chip 3 is placed on the reflective substrate 1 , the outer peripheral surface of the reflective substrate 1 is surrounded by a fixed bracket 6 , and the fixed bracket 6 is fixedly connected with the reflective substrate 1 . The fixed support 6 is provided with a fixedly connected conductive electrode 7 , and the conductive electrode 7 is electrically connected to the LED light-emitting chip 3 by wires, and is used to provide power to the LED light-emitting chip 3 . The fixed bracket 6 is provided with a fixedly connected conductive pin 8, the conductive pin 8...

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PUM

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Abstract

The invention relates to a light-emitting diode (LED) packaging structure, in particular to a reflective type LED packaging structure. The structure comprises a reflecting base plate and an LED light-emitting chip, wherein the LED light-emitting chip is positioned on the reflecting base plate; the reflecting base plate is provided with a reflecting groove corresponding to the lower end for placing the LED light-emitting chip and totally reflects light projected to the reflecting base plate on the surface for placing the LED light-emitting chip by the reflecting groove at the end part and side walls at both sides of the reflecting groove; the left end and the right end of the reflecting base plate are both provided with fixed brackets, and the fixed brackets are fixedly connected with the reflecting base plate; conducting electrodes which are fixedly connected are arranged in the fixed brackets and electrically connected with the LED light-emitting chip; conducting pins are arranged on the fixed brackets and electrically connected with the conducting electrodes. The invention has simple structure, is safe and reliable, and improves the luminance of an LED light source and the utilization ratio of the light emission of the LED.

Description

technical field [0001] The invention relates to an LED package structure, in particular to a reflective LED package structure. Background technique [0002] An LED is a semiconductor that converts electrical energy into visible light. LED lighting is an emerging industry developed in recent years. It can be called another lighting revolution since the advent of incandescent lamps in the 19th century. The third generation of lighting sources after sodium lamps, etc.). [0003] Because semiconductor lighting has significant advantages such as high efficiency, energy saving, environmental protection, long service life, fast response, vibration resistance, and easy maintenance, it is internationally recognized as a new type of solid-state cold light source that is most likely to enter the field of general lighting. Just as transistors replace electron tubes, semiconductors replace traditional incandescent and fluorescent lamps. [0004] At present, although LEDs have been wid...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/60H01L33/58H01L33/64
Inventor 王海军
Owner 王海军
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