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Printed wiring board

A printed circuit board and circuit technology, which is applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as poor connection, easy cracks, easy to break the substrate, etc.

Active Publication Date: 2010-07-28
IBIDEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in a printed wiring board having a through-hole having a drum-shaped longitudinal section as described above, the through-hole filled by plating has a so-called neck portion whose diameter decreases from the surface opening to the center, and Since the shape is approximately symmetrical across the central axis, when warping occurs on the insulating resin base material, the stress tends to concentrate on the periphery of the neck portion of the through hole.
As a result, cracks are likely to occur around the neck portion, and therefore, there is a problem that poor connection is caused by the cracks, or the substrate is easily folded, so that sufficient mechanical strength cannot be obtained.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0098] (1) First, a circuit board (core portion) as a unit constituting a multilayer printed wiring board is fabricated. This circuit board is a substrate that becomes the center of lamination among a plurality of insulating layers to be laminated, and a double-sided copper-clad laminate 10 obtained by laminating prepreg cloth and copper foil and heating and pressing is used as a starting material (see FIG. 4 (a)), this prepreg cloth is obtained by impregnating glass fiber cloth with epoxy resin and making it a B-stage.

[0099] The insulating resin substrate 12 has a thickness of 300 μm, and the copper foil 14 has a thickness of 3 μm. The copper foil of this laminated board uses copper foil with a thickness greater than 3 μm, and the thickness of the copper foil is adjusted to 3 μm by etching.

[0100] (2) Carbon dioxide gas laser irradiation is performed on a predetermined position on one surface of the double-sided circuit board 10 to form the first opening 16 (refer to FI...

Embodiment 1-2

[0170] The through-hole 20 was formed in the same manner as in Example 1-1 except that the first opening 16 and the second opening 18 had a through-hole 20 with a center of gravity offset of 5 μm and a neck diameter of 76 μm by laser irradiation. A multilayer printed circuit board is produced.

Embodiment 1-3

[0172] The through-hole 20 was formed in the same manner as in Example 1-1 except that the center of gravity axis of the first opening 16 and the second opening 18 was shifted by 10 μm and the neck diameter was 80 μm by laser irradiation. A multilayer printed circuit board is produced.

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Abstract

A printed wiring board with through-holes having an insulating resin substratum provided with through-holes whose interior is filled with plating, wherein the positions of center-of-gravity axes of respective through-holes exposed from the front surface and rear surface of the insulating resin substratum are arranged so as to be shifted from each other. Thus, there is provided a printed wiring board with through-hole structure that realizes reducing of defects, such as void, and cracking, reducing of board connection failure and increasing of the mechanical strength of the board.

Description

[0001] This application is a divisional application of an application with a filing date of February 20, 2007, an application number of 200780001054.8, and an invention title of "Printed Circuit Board and Its Manufacturing Method". technical field [0002] The present invention relates to a printed wiring board in which a plated conductor is formed in a through hole formed in an insulating material. More specifically, it relates to a printed wiring board in which poor conduction of the plated conductor is improved and the strength of the substrate is improved. Background technique [0003] In conventional printed wiring boards, as plated through holes for electrically connecting conductor circuits respectively formed on the front and back surfaces of an insulating resin base material, there are cases where the through holes formed in the insulating resin base material are filled by electroplating. Filled vias made of metal. The above-mentioned insulating resin base material ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11
CPCH05K2201/09827H05K3/427H05K2201/09836H05K2201/09854H05K3/423H05K2203/1572H05K3/0032H05K1/119Y10T29/49124Y10T29/49126H05K3/40H05K3/46C25D5/02H05K3/0026H05K3/0094H05K3/422
Inventor 池田大介
Owner IBIDEN CO LTD
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