A manufacturing process of n+n blind pressing large backplane

Abstract

The invention discloses a manufacturing process of an N+N blind-pressed large backboard, comprising the following steps: providing a first sub-board, a second sub-board, an inner core board and an outer layer copper foil, the first sub-board, the second Drilling positions are provided on the corresponding positions of the sub-board and the inner core board; inner-layer circuits are respectively made on the first sub-board, the second sub-board and the inner core board, and the first sub-board and the second sub-board The inner circuit of the inner layer includes the first annular ring arranged around the drilling position, and the inner layer circuit on the inner core board includes the second annular ring arranged around the drilled position; the outer layer copper foil, the first sub-board, the inner The core board, the second sub-board, and the outer copper foil are stacked sequentially through PP and then pressed into a production board; drill through holes on both sides of the production board by drilling up and down; carry out post-processing on the production board, The N+N blind pressed large backplane was prepared. The invention solves the problem of voids at the edge of the hole ring caused by poor glue filling of the hole ring in the inner layer, reduces the problem of interruption of the drill bit during the drilling process, and also solves the problem of displacement during the drilling process.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a manufacturing process of an N+N blind-pressed large backboard. Background technique [0002] The production process of the existing high-layer backplane is: material cutting→inner layer graphics 1→inner layer etching 1→inner layer AOI 1→lamination 1→inner layer drilling→copper sinking→full board electroplating→inner layer graphics Two→inner layer etching two→inner layer AOI two→immersion nickel gold→lamination two→outer layer drilling→outer layer copper sinking→outer full board plating→outer layer graphics→graphic plating→outer layer etching→after process, In the above method, due to the large number of layers of the circuit board, multiple laminations are used. [0003] The manufacturing method of the above-mentioned high multi-layer backplane has the following defects: [0004] (1) A single sheet of non-flowing glue PP is used for lamination bet...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the above-mentioned existing technical defects, the present invention provides a manufacturing process of N+N blind pressing large backplane, which solves the problem of voids at the edge of the hole ring caused by poor glue filling of the inner layer hole ring, and reduces the interruption of the drilling process The problem of the drill bit also solves the problem of deviation during the drilling process