Radiation detector

Abstract

A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a flexible substrate including a connection pattern connected to an element electrode on an opposite side to the substrate of the semiconductor element. The semiconductor element is disposed on one surface of the substrate, and the flexible substrate is disposed on the opposite side to the substrate of the semiconductor element.

Description

technical field [0001] The present invention relates to radiation detectors. In particular, the present invention relates to a radiation detector used in a radiation detection device that detects radiation such as γ-rays and X-rays. Background technique [0002] As a conventional radiation detector, it is known that a plurality of common electrode plates, a plurality of semiconductor elements, and a plurality of electrode plates are arranged between two frames so that a common electrode plate, a semiconductor element, an electrode plate, a semiconductor element, and a common electrode are arranged. A radiation detector in which one frame and the other frame are fixed with pins to a laminated body stacked in the form of plates (for example, refer to Patent Document 1: US Patent No. 6,236,051). [0003] In the radiation detector described in Patent Document 1, since a pair of semiconductor elements adjacent in the lateral direction share a common electrode plate, the region w...

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Problems solved by technology

[0004] However, in the radiation detector of Patent Document 1, since the radiation detector is formed by stacking a plurality of components such as a common electrode plate and a semiconductor element, a dimensional error of each component is added to each of the stacked components. It is difficult to arrange a plurality of semiconductor elements at high density while strictly controlling the interval between semiconductor elements to a predetermined interval

In addition, the radiation detector of Patent Document 1 is constituted by tightening two frames with pins, so it may be difficult to uniformly apply tightening pressure to the semiconductor element, the semiconductor element and the monopolar plate may not be properly connected, and there may be excessive tightening. When mechanical stress is applied to the semiconductor element

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