Acetylene compound

Abstract

Disclosed is an acetylene compound represented by the general formula (1) below, which is useful as a raw material for fused polymers having high heat resistance. (In the formula (1), the encircled Ar represents an aryl group or a heteroaryl group; X represents a divalent linking group; R, R' and R1 each represents a hydrogen atom, a hydrocarbon group or a heterocyclic group; R2 represents a hydrogen atom or a substituent which may be substituted by a benzene ring; A represents a hydrocarbon group or a heterocyclic group; Q represents a hydrogen atom, a hydrocarbon group or a metal element capable of forming a monovalent metal salt; a represents an integer of not less than 0; and b, m and n each represents an integer of not less than 1. When all of n, m and b are 1 at the same time, X is not -(C=O)O-; and when n is 2 and both m and b are 1, X is not -O-).

Description

technical field The present invention relates to a novel acetylene compound having a carboxylic acid or a derivative thereof as a functional group in the molecule, which is used as a thermosetting resin, a liquid crystal material, a nonlinear optical material, an electronic material, a material for an adhesive, a material for a sliding agent, It is useful as a raw material for functional materials such as additives for photography, materials for gas separation membranes, and intermediates for medical and agricultural chemicals. Background technique Compounds having an acetylene group are important compounds as raw materials for functional materials such as thermosetting resins, liquid crystal materials, and nonlinear optical materials. Research objects related to functional materials have attracted much attention. For example, polyimide oligomers are used as materials that impart thermosetting properties, heat resistance, and oxidation resistance (for example, US Patent No....

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