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Fabricating methods for special power electronic circuit board for power supply and power module

A technology for power electronics and power modules, which is applied to the production of power electronic circuit boards and power modules for power supplies, can solve problems such as low integration, inconvenient design, and thick sealant, and achieve the effect of overcoming small capacity.

Inactive Publication Date: 2010-10-06
章祖文
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its disadvantages are: the sealant is very thick, it can only be cooled on one side, and the integration level is not high. The shapes of the same power modules produced by various manufacturers are different. For a power supply that requires multiple power modules, there are many differences in design. inconvenience
If the copper board is thick, it is not easy to make power electronic circuit boards with DCB ceramic copper clad laminates, and there is also the problem of metallization of via holes.

Method used

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  • Fabricating methods for special power electronic circuit board for power supply and power module
  • Fabricating methods for special power electronic circuit board for power supply and power module
  • Fabricating methods for special power electronic circuit board for power supply and power module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1. Make A type, B type, E type special-purpose power electronic circuit board with A type, B type, E type general power electronic circuit board substrate

[0044] The method of making A-type, B-type, E-type special-purpose power electronic circuit boards with A-type, B-type, E-type general power electronic circuit board substrates is as follows:

[0045] 1. Draw the arrangement and wiring diagram of various power module components, determine the arrangement and wiring diagram of general components and the copper mooring distribution diagram on the front and back of the general power electronic circuit board substrate of type A, type B and type E, and outsource customizing type A and B Type and E-type general-purpose power electronic circuit board substrates. The general-purpose holes on the substrate are holes with a diameter of 1 mm. Such as Figure 1a , Figure 1b , Figure 3a , Figure 3b , Figure 4a with Figure 4b ;

[0046] 2. Make power copper ...

Embodiment 2

[0056] Embodiment 2. Make C type, D type, F type special-purpose power electronic circuit board with C type, D type, F type general power electronic circuit board substrate

[0057] The method of making C-type, D-type, and F-type special-purpose power electronic circuit boards with C-type, D-type, and F-type general-purpose power electronic circuit board substrates is as follows:

[0058] 1. Draw C-type, D-type, F-type general power electronic circuit board substrate structure diagrams, and outsource custom C-type, D-type, F-type substrates, such as Figure 2a , Figure 2b , Figure 2c , Figure 2d , Figure 5a with Figure 5b ;

[0059] 2. Steps 2, 3, 4, and 5 are the same as in Example 1.

Embodiment 3

[0060] Embodiment 3. adopt D type, F type universal power electronic circuit board substrate to make D type, F type special power electronic circuit board with casting method

[0061] The method of making D-type and F-type special-purpose power electronic circuit boards by casting method is as follows:

[0062] 1. Draw the structure diagram of D-type and F-type substrates, casting boxes, copper wire slot filler blocks with power, and wireless slot filler blocks, and outsource customized D-type and F-type substrates, casting boxes, copper wire slot filler blocks with power, and wireless slot filler blocks. Slot filler blocks such as Figure 12a , Figure 12b , Figure 12c , Figure 12d ;

[0063] 2. Put the D-type or F-type substrate face up into the casting box;

[0064] 3. Put the filler block with power copper wire groove into the casting box with the wire groove facing down and make the wire groove of the filler block coincide with the extension line of the output end ...

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Abstract

The invention discloses fabricating methods for a special power electronic circuit board for a power supply and a power module. The fabricating method of the special power electronic circuit board for the power supply is characterized by comprising the following step of fabricating a general power circuit electronic circuit board substrate, including the steps of fabricating a power copper wire with a tin rivet on the back side of the substrate and a power copper wire with a tinplating passing rivet hole on the front side of the substrate and combing the two copper wires. The fabricating method for the special power module comprises the steps of welding a commercially-sold power electronic element, a protective electronic element and partial control electronic elements on the special electronic circuit board and packaging the electronic elements with a heat-conducting insulated gum metal plate, wherein the power electronic element, the protective electronic element and the partial control electronic elements on a bearing metal plate with heat-conducting insulated gum on the special power electronic circuit board are fabricated by using an integrated circuit method, connected with the circuit board and packaged by using the heat-conducting insulated gum. The special power electronic circuit board has simple production and high practicability. The special power module has high integration level, high power and capability of being cooled and inserted on two surfaces.

Description

technical field [0001] The invention relates to a manufacturing method of a power electronic circuit board and a power module, in particular to a manufacturing method of a special power electronic circuit board and a power module for a power supply. technical background [0002] At present, power modules mostly integrate several high-voltage, high-current electronic components and protective electronic components on an insulated metal plate, vertical leads, screw connection, sealant packaging, no power electronic circuit board, or DCB ceramics Copper clad laminates are used as simple power electronic circuit boards. Its disadvantages are: the sealant is very thick, it can only be cooled on one side, and the integration level is not high. The shapes of the same power modules produced by various manufacturers are different. For a power supply that requires multiple power modules, there are many differences in design. Inconvenience. If the copper board is thick, it is not eas...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 章祖文
Owner 章祖文
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