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Adhesive film and wafer processing tape

A technology for bonding films and wafers, applied in the direction of adhesives, film/sheet adhesives, semiconductor devices, etc., it can solve the problem of not being able to fit wafers, and achieve the effect of ensuring adhesion and reducing chip breakage.

Inactive Publication Date: 2010-10-20
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Here, it is considered to reduce chipping by lowering the storage modulus of elasticity before curing of the adhesive layer, but there is a problem that wafers cannot be bonded if only the storage modulus of elasticity is lowered.

Method used

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  • Adhesive film and wafer processing tape
  • Adhesive film and wafer processing tape
  • Adhesive film and wafer processing tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0103] To the above-mentioned acrylic polymer (1) obtained, each material shown in Table 1 was added in the compounding ratio shown in the same table, and the varnish of the adhesive material composition was obtained. The obtained varnish was coated on a polyethylene terephthalate (PET) film with a thickness of 50 μm, and heated and dried at 120° C. for 10 minutes to form a coating film in a B-stage state with a film thickness of 50 μm to produce an adhesive film. The adhesive film of Example 1 of the agent layer.

Embodiment 2

[0105] The materials shown in Table 1 were added to the obtained acrylic polymer (1) in the compounding ratio shown in the same table, and the adhesive film of Example 2 having an adhesive layer was produced in the same manner as in Example 1.

Embodiment 3

[0107] The materials shown in Table 1 were added to the obtained acrylic polymer (1) in the compounding ratio shown in the same table, and the adhesive film of Example 3 having an adhesive layer was produced in the same manner as in Example 1.

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Abstract

The present invention provides an adhesive film and wafer processing tape. The adhesive tap can be used for generalizing the resin of the adhesive layer to acrylic resin, etc. The bonding performance of the wafer can be ensured, and chip breakage or chip defect in cutting can be reduced. The wafer processing tape 10 comprises the following components: a bonding film 12 which is composed of a substrate film 12a and an adhesive layer 12b formed whereon, and an adhesive layer 13 laminated on the adhesive layer 12. When the density of the adhesive layer 13 is set to phi(g / cm3) and the least storage elastic modulus is set to Gmin(MPa), phi*Gmin is above 0.2. Through combining two factors of Gmin and phi and causing the two factors to complement each other, the binding performance of the adhesive layer 13 to the semiconductor wafer can be ensured, and the pieces generated in cutting is reduced.

Description

technical field [0001] The present invention relates to an adhesive film having an adhesive (adhesive) layer bonded (bonded) to a semiconductor wafer, and a tape for wafer processing, comprising: a substrate film and a substrate provided on the substrate film An adhesive film composed of an adhesive layer, and an adhesive layer provided on the adhesive layer. Background technique [0002] When a semiconductor wafer is processed to manufacture a semiconductor device, in recent years, the adhesive layer of the adhesive film is bonded by thermocompression on the back surface of the semiconductor wafer to obtain a semiconductor wafer with an adhesive layer, and the semiconductor wafer with an adhesive layer Paste on a dicing sheet, and cut (cut) the semiconductor element into chip units by dicing. [0003] However, with the further thinning of semiconductor elements (chips), when dicing semiconductor elements into individual pieces, adjacent chips contact each other due to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/02H01L21/68H01L21/78
CPCH01L24/27H01L2224/83191H01L2924/10253H01L2924/00
Inventor 石黑邦彦石渡伸一盛岛泰正
Owner FURUKAWA ELECTRIC CO LTD
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