Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ring-opening silicon substrate pressure sensor thick film circuit

A pressure sensor and thick film circuit technology, applied in the direction of measuring fluid pressure, instruments, measuring devices, etc., can solve the problems of sensor accuracy loss, low production efficiency and reliability, and discontinuous resistance value, so as to ensure the insulation resistance and Improvement of dielectric strength, appearance quality, and expansion of compensation temperature range

Inactive Publication Date: 2010-10-20
山东佰测传感科技股份有限公司
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The performance indicators of silicon-based pressure sensors are highly discrete. In the process of temperature compensation and calibration, the assembly processes such as manual screening of resistors and welding resistors are very complicated, resulting in low production efficiency and reliability; It also leads to loss of sensor accuracy

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ring-opening silicon substrate pressure sensor thick film circuit
  • Ring-opening silicon substrate pressure sensor thick film circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] like figure 1 As shown, the thick-film circuit for temperature compensation and calibration uses a 4×4-0.025-inch ceramic substrate 1 as a substrate. In order to be suitable for mass production, the ceramic substrate 1 adopts laser pre-scribing technology, and each substrate is divided into 6× An array of 6, cut into 2 of thirty-six compensating plates. Each compensation plate 2 is designed with an assembly hole 3 according to the requirements of the packaging form. The shape of the compensation plate 2 is designed to be a regular octagon, and the outer diameter of the octagon is suitable for packaging. The assembly hole 3 on the compensation plate and the four non-adjacent sides are cut through with a digital positioning laser. A detection pin hole 4 is arranged around the assembly hole 3 , and a circuit is printed or laser etched on the compensation plate 2 . In order to insulate and isolate from the outside world, the compensation plate 2 is also coated with a glas...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a ring-opening silicon substrate pressure sensor thick film circuit, which belongs to the technical field of pressure sensors and is characterized by comprising a ceramic substrate, wherein the ceramic substrate is provided with a plurality of compensation plates in an array mode; the compensation plates are connected with each other; each compensation plate is provided with a pilot hole; the periphery of the pilot hole is provided with probe pinholes; and the compensation plate is printed or laser-etched with a circuit. In the invention, the ceramic substrate replaces PCB plate grids, thereby enabling the calibration accuracy of the sensor to be improved, widening the compensation temperature area, comprehensively improving the reliability, shock resistance, high-low temperature impact resistance and exterior quality of the sensor, and more importantly providing process guarantee for manufacturing pressure sensors in scale.

Description

technical field [0001] The invention belongs to the technical field of pressure sensors, in particular to an open-loop silicon-based pressure sensor thick-film circuit. Background technique [0002] In the process of traditional production of pressure sensors, PCB board networks and separate resistors are often used to achieve temperature compensation and calibration. The performance indicators of silicon-based pressure sensors are highly discrete. In the process of temperature compensation and calibration, the assembly processes such as manual screening of resistors and welding resistors are very complicated, resulting in low production efficiency and reliability; It also results in a loss of sensor accuracy. Contents of the invention [0003] The object of the present invention is to provide a thick film resistance compensation plate for temperature compensation and calibration of silicon-based pressure sensors. [0004] The concrete technical scheme that the present i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01L19/04G01L27/00
Inventor 丁立新
Owner 山东佰测传感科技股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com