Plasma processing equipment and method for placing workpieces to be processed on static chuck thereof

A technology for electrostatic chucks and workpieces to be processed, which is applied in the field of microelectronics and can solve problems such as limiting the debugging process, reducing processing efficiency, and difficulty in ensuring accuracy.

Active Publication Date: 2011-09-14
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At present, the method of placing the workpiece on the electrostatic chuck is difficult to ensure the accuracy of the position of the workpiece on the electrostatic chuck. Only by placing the parts to be processed accurately on the manipulator can the transfer position be determined more accurately, thus limiting the debugging process and reducing the processing efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plasma processing equipment and method for placing workpieces to be processed on static chuck thereof
  • Plasma processing equipment and method for placing workpieces to be processed on static chuck thereof
  • Plasma processing equipment and method for placing workpieces to be processed on static chuck thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The core of the present invention is to provide a method for placing workpieces to be processed on the electrostatic chuck, so that the plasma processing equipment can quickly and accurately place the workpieces to be processed on the electrostatic chuck during use; another aspect of the present invention A core is to provide a plasma processing device.

[0038] In order to enable those skilled in the art to better understand the solutions of the present invention, the present invention will be further described in detail below in conjunction with the drawings and specific embodiments.

[0039] Please refer to image 3 , Figure 4 and Figure 5 , image 3 A flowchart of a method for placing a workpiece on an electrostatic chuck provided by a specific embodiment of the present invention; Figure 4 It is a schematic diagram of the positioning means of the positioning device and the electrostatic chuck provided by a specific embodiment of the present invention; Figur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for placing workpieces to be processed on a static chuck, which is characterized in that the wafer transfer position of a manipulator is determined by a locating device so that the workpieces to be processed can be quickly and accurately placed on the static chuck. The invention also discloses plasma processing equipment capable of using the method. The method or the device can finish the adjustment process in one step and avoid the repeated adjustments through the combination of naked eyes and manual operations, thereby greatly improving adjustment speed, saving a lot of adjustment time, and greatly enhancing the accuracy that the workpieces to be processed fall on the position of the static chuck; furthermore, the adjustment of a technical chamber can befinished without using the workpieces to be processed, thereby further improving working efficiency.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a method for placing workpieces to be processed on an electrostatic chuck. The present invention also relates to a plasma processing device in which the above method can be used. Background technique [0002] With the popularity of microelectronic products, plasma processing equipment is more and more widely used in the field of microelectronic technology. [0003] Please refer to figure 1 , figure 1 It is a schematic diagram of a typical plasma processing equipment. [0004] The plasma processing apparatus 1 generally comprises a housing 11 having a reaction chamber 12 therein. The top and bottom of the reaction chamber 12 are respectively provided with an upper pole plate 13 and an electrostatic chuck 14 correspondingly, and the upper pole plate 13 is isolated from the housing 11 by an insulating member 15; the top of the electrostatic chuck 14 can support the pie...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/683H01L21/68H01L21/677
Inventor 魏小波
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap