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High-frequency circuit substrate and production method thereof

A circuit substrate and high-frequency technology, which is applied in the field of high-frequency circuit substrate and its production, can solve the problems of affecting the use effect of the circuit board, affecting the function of the circuit board, and the circuit is easy to fall off or break, so as to improve passive intermodulation, The effect of ensuring stability is not easy to fall off or break

Active Publication Date: 2012-02-01
珠海国能复合材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, circuit boards (PCBs) are widely used in various manufacturing fields and are one of the essential components of electronic products. With the continuous advancement of electronic technology, electronic information products continue to develop in the direction of high frequency and high speed. Traditional The circuit substrates are gradually replaced by high-speed, high-reliability high-frequency circuit substrates. In recent years, PTFE glass cloth copper-clad laminated substrates have been Wide and other excellent characteristics have been widely used in high-frequency circuit substrates, but because polytetrafluoroethylene resin (PTFE) has a layer of inert fluorine-containing shell outside its molecules, it has outstanding non-stick properties, resulting in a Poor adhesion and low peel strength affect the use effect of the circuit board. During use, the circuit is easy to fall off or break, which seriously affects the function of the circuit board. This has always been a key performance indicator for the production of this substrate
[0003] In summary, the existing high-frequency circuit substrates have technical defects such as low peel strength and easy detachment or breakage of the circuit

Method used

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  • High-frequency circuit substrate and production method thereof
  • High-frequency circuit substrate and production method thereof
  • High-frequency circuit substrate and production method thereof

Examples

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Effect test

Embodiment 1

[0020] Such as figure 1 As shown, this embodiment is a high-frequency circuit substrate with single-sided copper foil. The high-frequency circuit substrate in this embodiment includes a copper foil 1 and an insulating medium layer. The insulating medium layer is arranged below the copper foil 1. Described insulating medium layer comprises several layers of dipped cloth 21 and several layers of pure PTFE film 22, and described dipped cloth 21 is spaced apart from described pure PTFE film 22 and bonding, and the uppermost layer of described insulating medium layer is dipped cloth 21, so The copper foil 1 is bonded to the dipped cloth 21 on the uppermost layer of the insulating medium layer, the copper foil 1 includes a bright surface I and a rough surface I, the bright surface I of the copper foil 1 faces downward, and the The dipped cloth 21 on the uppermost layer of the insulating medium layer is bonded to the bright surface I of the copper foil 1 .

[0021] The manufacturing...

Embodiment 2

[0026] Such as figure 2 As shown, this embodiment is a high-frequency circuit substrate with double-sided copper foil. Compared with Embodiment 1, this embodiment also includes a lower layer of copper foil 3, the bottom layer of the insulating medium layer is dipped cloth 21, and the lower layer The copper foil 3 is bonded to the dipped cloth 21 at the bottom of the insulating medium layer; the lower layer copper foil 3 includes a bright surface II and a rough surface II, and the bright surface II of the lower layer copper foil 3 faces upward, so The dipped cloth 21 on the bottom layer of the insulating medium layer is bonded to the bright surface II of the lower copper foil 3 .

[0027] The manufacturing method of the high-frequency circuit substrate described in this embodiment includes the following steps:

[0028] A), preparation of dipped cloth: get glass fiber cloth and put it into PTFE resin for pre-impregnation, and make described dipped cloth after pre-impregnation;...

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Abstract

The invention discloses a high-frequency circuit substrate and a production method thereof and aims at providing a high-frequency circuit substrate with high stripping strength and insusceptible falling off or breakage of a circuit and a production method thereof. The high-frequency circuit substrate comprises a copper foil (1) and an insulated medium layer arranged below the copper foil (1), wherein the insulated medium layer comprises a plurality of layers of impregnated fabrics (21) and a plurality of layers of pure PTFE (Polytetrafluoroethylene) thin film (22); the impregnated fabrics (21) are spaced and bonded with the pure PTFE thin film (22); the impregnated fabrics (21) are arranged at the upper most layer of the insulated medium layer; and the copper foil (1) is spliced with the impregnated fabrics (21) on the upper most layer of the insulated medium layer. The production method of the high-frequency circuit substrate comprises the following steps of: producing the insulated medium layer by spacing and bonding the impregnated fabrics obtained by using glass fiber fabric to impregnate PTFE resin with the pure PTFE thin film; coating the copper foil on the impregnated fabrics on a first layer of the insulated medium layer; and laminating to obtain the high-frequency circuit substrate. The invention can be widely applied to the fields of high-frequency circuit substratesand production thereof.

Description

technical field [0001] The invention relates to a high-frequency circuit substrate and a manufacturing method thereof. Background technique [0002] At present, circuit boards (PCBs) are widely used in various manufacturing fields and are one of the essential components of electronic products. With the continuous advancement of electronic technology, electronic information products continue to develop in the direction of high frequency and high speed. Traditional The circuit substrates are gradually replaced by high-speed, high-reliability high-frequency circuit substrates. In recent years, PTFE glass cloth copper-clad laminated substrates have been Wide and other excellent characteristics have been widely used in high-frequency circuit substrates, but because polytetrafluoroethylene resin (PTFE) has a layer of inert fluorine-containing shell outside its molecules, it has outstanding non-stick properties, resulting in a Poor adhesion and low peel strength affect the use eff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03H05K3/38
Inventor 葛凯李勋山刘庆辉
Owner 珠海国能复合材料科技有限公司