Method for preparing ultra-fine diamond grinding wheel of vitrified bond
A vitrified bond and diamond grinding wheel technology, applied in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc., can solve the problems of high surface roughness, large depth of subsurface damage layer, high processing time and cost, etc. Achieve the effects of reducing surface roughness, increasing porosity, and efficient ultra-precision grinding
Inactive Publication Date: 2011-09-14
DALIAN UNIV OF TECH
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[0003] The purpose of this invention is to provide a vitrified bond superfine diamond grinding wheel preparation method, using a composite vitrified bond and the method of ultrafine diamond abrasives, and utilizing the method of dispersant, refiner and foaming agent to improve the vitrified bond superfine The porosity of the fine diamond grinding wheel, the high bonding strength of the vitrified bond and the relatively high thermal conductivity, solve the problem of high surface roughness and sub-surface damage layer depth caused by the traditional resin bond diamond grinding wheel processing method. The disadvantage of being too large, which makes the processing time and cost relatively high
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[0012] The specific embodiments of the present invention will be described in detail below in conjunction with the technical solutions and accompanying drawings.
[0013] Adopt #12000 ultra-fine diamond abrasive, the corresponding particle average diameter is 900 nanometers, as the abrasive material of ultra-fine diamond grinding wheel. At the same time, #15000 silicon carbide, silicon oxide, cerium oxide, and aluminum oxide are used as the raw materials of the vitrified bond, and the corresponding particle average diameter is about 700 nanometers. The silicon oxide is prepared as silica sol, and the volume percentage is 50%. Silicon carbide, silicon oxide sol, cerium oxide, and aluminum oxide are mixed uniformly by mechanical stirring in a volume ratio of 30:30:20:20 to prepare a vitrified bond. Sodium chloride and magnesium chloride are used as refiner and dispersant, the volume ratio of sodium chloride and magnesium chloride is 1:1, and the method of mechanical stirring is...
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Abstract
The present invention discloses a method for preparing an ultra-fine diamond grinding wheel of a vitrified bond, belongs to the technical field of ultra-precision machining of hard brittle and soft brittle photoelectric crystals, and in particular relates to an ultra-precise ground finish method for photoelectric semiconductor hard brittle and soft brittle photoelectric crystals. The method is characterized by comprising the following steps of: taking ultra-fine diamond powder which has a particle size of a valve from #10,000 to #300,000 as an ultra-fine diamond grinding material; taking three or four ultra-fine ceramics pulverulent body as bonding agents, taking one or two of chlorides or nitrates of potassium, calcium, sodium and magnesium as a dispersant and a refiner; taking one or two of dextrine, carbonates and hydrocarbonates as a foaming agent; pressing and molding by a cold-press molding method; uniformly heating to the temperature of between 480 and 530 DEG C from a room temperature; keeping the temperature for 30 to 60 minutes; uniformly heating to the temperature of between 580 and 610 DEG C; keeping the temperature for 40 to 60 minutes; uniformly heating to the temperature of between 640 and 680 DEG C; keeping the temperature for 100 to 150 minutes; and naturally cooling to the room temperature so as to sinter and mold the ultra-fine diamond grinding wheel. The method has the effects and the advantages of high-efficiency ultra-smooth low-damage grinding and high-efficiency ultra-precision grinding machining effect.
Description
technical field [0001] The invention belongs to the technical field of ultra-precision processing of hard and brittle and soft and brittle crystals, in particular to an ultra-precision grinding method for semiconductor hard and brittle and soft and brittle photoelectric crystals. Background technique [0002] With the rapid development of IC chip technology, the semiconductor industry has higher and higher requirements for the flatness, surface quality and integrity of silicon wafers. Because of its unique advantages, it is widely used in the field of ultra-precision grinding of silicon wafers. However, the currently used resin bonded diamond grinding wheel, due to the weak bonding force of the resin bond, the particle size of the grinding wheel is generally lower than #5000, which makes the surface roughness that the resin bonded grinding wheel can achieve generally Ra is generally several nanometer, and the depth of the subsurface damage layer is more than 100 nanometers....
Claims
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IPC IPC(8): B24D3/14B24D18/00
Inventor 张振宇赵洪浩霍凤伟郭东明
Owner DALIAN UNIV OF TECH