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A radiator installation structure and method

A heat sink, printed circuit board technology, applied in the direction of circuit heating devices, electric solid devices, semiconductor devices, etc., can solve the problems of destroying BGAIC package 13PCB12, solder ball rupture, etc.

Inactive Publication Date: 2015-08-19
THOMSON LICENSING SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the event that the entire assembly is impacted (such as falling to the ground), the springs 14a and 14b will contract and expand due to their elasticity, respectively as Figure 1C and 1D As shown, there may be more stress on the solder ball in the opposite direction, which may crack the solder ball, thereby destroying the BGA IC package 13 and the PCB 12

Method used

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  • A radiator installation structure and method
  • A radiator installation structure and method
  • A radiator installation structure and method

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Embodiment Construction

[0021] figure 2 is a perspective view of a radiator mounting structure according to an embodiment of the present invention. like figure 2 As shown, the heat sink 20 includes a heat absorbing portion 201, and two opposite corners of the heat radiating portion 201 are respectively provided with mounting portions 202a and 202b. Bolts 21a and 21b pass through the holes on the mounting parts 202a and 202b respectively to fix the heat absorbing part 201 on the PCB 22 and contact the BGA IC package 23 installed on the printed circuit board 22 to absorb the heat generated by the BGA IC package 23 . Springs 24a and 24b are respectively provided on the bolts 21a and 21b to elastically support the bolts 21a and 21b respectively in the vertical direction relative to the PCB 22 and to bring the heat absorbing portion 201 into contact with the BGA IC package 23 . The radiator 20 also includes a heat dissipation part 203 for dissipating the heat absorbed by the heat absorption part 201 ...

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Abstract

The present invention provides a method / device for mounting a heat sink on a Ball Grid Array (BGA) chip further on a Printed Circuit Board (PCB). In detail, the method uses glue at the corners and the periphery of the bottom of the heat sink to fasten the heat sink to the PCB.

Description

technical field [0001] The invention relates to a structure and method for installing a radiator on a printed circuit board. Background technique [0002] Circuit elements used in electronic devices, such as integrated circuit (IC) packages (hereinafter referred to as BGA IC packages) solder-mounted on printed circuit boards in a ball grid array (BGA) manner, generate heat during operation. Excessive heat build-up can damage circuit components and even cause equipment failure. In order to solve this problem, a heat sink is usually installed on the surface of the circuit element to dissipate heat. [0003] A heat sink generally includes a heat absorbing portion for absorbing heat generated by circuit components and a heat radiating portion for dissipating the absorbed heat. [0004] Figure 1A , 1B , 1C and 1D show a conventional structure for mounting a heat sink to a PCB. Figure 1A is a perspective view of the mounting structure. like Figure 1A As shown, the heat sink...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/40H01L21/48H05K7/20
CPCH01L2924/0002H01L21/50H05K2201/10734H01L23/40H05K3/305H05K1/0203H01L2924/15311Y02P70/50H01L2924/00
Inventor 邱健财石计委黄文新
Owner THOMSON LICENSING SA