Composite soldering material for soldering titanium alloy and ceramic and method for soldering by using same
A technology of composite solder and titanium alloy, which is applied in the direction of welding/welding/cutting articles, welding/cutting media/materials, welding media, etc., which can solve the problem of low joint strength, cracks in welded joints, and reduced wettability of base metals and other problems, to achieve the effect of improving the strength of the joint, good mechanical properties, and reducing the coefficient of thermal expansion
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specific Embodiment approach 1
[0012] Specific Embodiment 1: The composite solder used in this embodiment for brazing titanium alloys and ceramics consists of 30% to 60% Cu powder, 30% to 60% Ni powder and 0.5% to 35% reinforcing phase by weight. Composition, the reinforcement phase is TiB 2 powder or SiC powder.
[0013] In the composite solder of the present embodiment, Cu and Ni can dissolve the Ti element, and it is easy to form a reaction layer on the side of the ceramic or ceramic matrix composite material, and at the same time, the reinforcing particles (TiB 2 Or SiC) reacts with Ti elements to generate reinforcing particles in situ, reduce stress, pin grain boundaries, and increase strength.
specific Embodiment approach 2
[0014] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the composite solder used for titanium alloy and ceramic brazing consists of 40% to 50% Cu powder, 40% to 50% Ni powder and 1% to 10% reinforcement phase composition, the reinforcement phase is TiB 2 powder or SiC powder. Other parameters are the same as in the first embodiment.
[0015] The composition of the composite brazing filler metal of this embodiment is more preferable.
specific Embodiment approach 3
[0016] Specific embodiment three: the difference between this embodiment and specific embodiment one is that the composite solder for titanium alloy and ceramic brazing consists of 48.5% Cu powder, 48.5% Ni powder and 3% TiB by weight percentage 2 powder composition. Other parameters are the same as in the first embodiment.
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