Testing socket for package

Abstract

The invention discloses a testing socket for a package, comprising a testing socket body, a bearing part and a testing base. The test socket body comprises an accommodating space. The bearing part can be detachably installed on the testing socket body and comprises a plurality of detecting points corresponding to welding balls of the package. The testing base comprises a plurality of electrical contacts corresponding to the detecting points of the bearing part; the testing base can be installed on the testing socket body, and at least one part of the testing base can be accommodated in the accommodating space; according to the type of the package, the corresponding bearing part and testing base are installed on the testing socket body. Therefore, the invention has the advantages of lower testing cost, wider testing range, and capability of testing packages with different size types and different configurations of the welding balls.

Description

technical field [0001] The invention relates to a test socket, in particular to a package test socket. Background technique [0002] In the semiconductor industry, chip scale package (chip scale package) has gradually become one of the mainstream packaging technologies. However, according to product requirements, different chip scale package types must use different chip scale package test sockets to meet the requirements of back-end packaging. and testing requirements. [0003] For example, Taiwan Patent No. M327541 discloses a chip test fixture, which includes a test base and a pressure cover. An accommodating space is provided in the center of the test base for accommodating the chips to be tested. The press cover includes a cover body and a press member, one side of the cover body is pivotally connected to the test base to pivotally cover the accommodating space of the test base; the press member Elastically arranged on one side of the cover body adjacent to the accom...

AI Technical Summary

Problems solved by technology

[0004] However, the chip test fixture is made according to the predetermined size of the chip to be tested and the configuration of solder balls (solder ball), so after the assembly is completed, the chip test fixture can only be tested for one type of chip

When testing different chip types, the entire set of test fixtures must be replaced, which will increase the cost of testing and cause waste of resources

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