Method for forecasting operation life of integrated circuit based on phase shifting electronic speckle pattern interferometry

Abstract

The invention discloses a method for forecasting the operation life of an integrated circuit based on phase shifting electronic speckle pattern interferometry (ESPI). The method is characterized by measuring the change rule of the off-plane displacement of the packaged surface of the integrated circuit test piece under the temperature accelerated life test through phase shifting ESPI, determining the failure point, computing the failure activation energy according to the relationship between the off-plane displacement of the failure point and the temperature curve and finally forecasting the life according to the established life forecasting model. The method can measure the information of the whole surface while measuring the surface displacement of the integrated circuit test piece chip, can realize online continuous detection and is more precise in measurement.

Description

technical field [0001] The invention relates to the field of reliability analysis and life prediction of integrated circuit test pieces, in particular to a method for predicting the working life of integrated circuits based on phase shift electronic speckle interference technology. Background technique [0002] With the development of electronic technology, there are more and more new varieties of electronic integrated circuit test pieces, and the reliability test technology is becoming more and more difficult. Various test detection devices, test detection technologies, and test evaluation methods are also constantly developing. At present, the prediction of the working life of the integrated circuit test piece chip is mainly to select the change of the test electrical parameters in the accelerated life test as the failure criterion to calculate the failure activation energy, and then calculate the working life of the chip through finite element simulation. Since the electr...

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Problems solved by technology

Since the electrical parameters of the integrated circuit test piece chip are constantly changing during the accelerated life test, the correct measurement can only be accurately measured after the accelerated life test is completed, so the test time is relatively long and the test process is relatively complicated.

In addition, the finite element analysis simulation evaluation of the reliability of the integrated circuit test piece chip is simulated according to the working environment of the chip. However, due to the many environmental factors in actual work, there are large errors in the simulation calculation, and the chip cannot be evaluated more accurately. field service life

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