Glass ball cavity encapsulation method of light emitting diode

A technology of light-emitting diodes and packaging methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of poor light transmission of lenses, poor moisture resistance of organic matter, and poor light transmission performance, and achieve small viewing angles, not easy to age, and good Isophotic effect

Inactive Publication Date: 2010-11-24
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technical means described involve creating tiny holes within a semiconductor device called LC Microcabraves, allowing the light source to emit light through negative resistance change caused by changing polarization states due to electrostatic force. By applying specific voltages and cooling processes, the resulting packages may maintain their original dimensions even if they were cracked over many times before being mounted onto circuit boards. Additionally, there is no risk of damage to the components themselves because these techniques allow for effective removal of any cracks occurring during assembly.

Problems solved by technology

This patented technical solution described in this patents relates to developing an improved LED lamp that uses less power while maintaining bright colors over longer periods without losing effectiveness or causing damage from humidity. Additionally, it addresses issues with sealing the LED packages during manufacturing process which may cause deformation caused by temperature changes.

Method used

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  • Glass ball cavity encapsulation method of light emitting diode
  • Glass ball cavity encapsulation method of light emitting diode
  • Glass ball cavity encapsulation method of light emitting diode

Examples

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Embodiment 1

[0029] A method for encapsulating a light-emitting diode in a glass bulb cavity, comprising the following steps: the first step is to prepare a glass package with a microcavity on the back and a microlens on the front on a glass wafer; the glass package is prepared by positive pressure thermoforming , its size is slightly larger than the light-emitting diode (LED) chip of required packaging, and its height is greater than the thickness of the LED chip. The specific preparation method can be seen in embodiment 3-4. The second step, chip mounting: assemble the light-emitting diode (LED) chip On the silicon wafer substrate; the assembly process includes the lead-out of the LED chip, the silicon wafer is provided with leads, and the leads can also be guided to the back through silicon vias. The third step is the phosphor coating process: the phosphor (YAG: ce3+) Mix it with silica gel (Jiuqi brand WH-7 type silicone sealant produced by Nanjing Xilite Adhesive Co., Ltd.), and evenly...

Embodiment 2

[0031] Embodiment 2 A glass bulb cavity packaging method for light emitting diodes, comprising the following steps:

[0032] The first step is to prepare a glass lens array for sealing light-emitting diode (LED) chips on Pyrex7740 glass; under high temperature, the heat release agent releases gas, which forms a convex lens due to blowing out of the silicon microgroove when the glass is melted, and simultaneously under the lens A microcavity is formed, enabling a light emitting diode (LED) chip to be placed and sealed within the microcavity under the glass lens. For the preparation method of the glass lens microcavity, see the following embodiments of the present invention. The following examples of the present invention describe the method of making glass lenses by positive pressure forming. The glass microcavity prepared by the method described in the embodiment behind this embodiment adopts different microgroove aspect ratios, and the time and temperature of glass molding a...

Embodiment 3

[0037] Embodiment 3 A method for manufacturing a wafer-level glass lens microcavity, comprising the following steps:

[0038] In the first step, a specific pattern is formed on an Si wafer (such as a 4-inch wafer) by etching using a Si micromachining process, and the micromachining process of the pattern structure on the Si wafer is a wet etching process or a dry inductively coupled plasma One of the bulk (ICP) etching process, reactive ion etching or deep reactive ion etching, the pattern can be a square or circular groove array, or a number of different graphics, (in fact, three-dimensionally, Engraving a specific pattern is to carve a groove on a silicon wafer, which is a pattern in two dimensions), and the aspect ratio of the microgroove can be less than 1:1 or greater than 1:1, for example: 2:1, 3:1, 4:1 , 7:1, 10:1, 15:1, 20:1, 25:1, the glass microcavity with high aspect ratio will provide more rheological space for the glass, thus providing more space for the package c...

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Abstract

The invention discloses a method for encapsulating a light emitting diode by using a glass lens cavity with high extracting rate and light beam collimation. The method comprises the following steps of: step 1, preparing a glass lens of a sealed light emitting diode chip on a glass wafer; step 2, reversely welding a chip: reversely welding the light emitting diode on a silicon substrate distributed with a lead A1; step 3, coating fluorescent powder: evenly coating a fluorescent powder layer on the periphery of the light emitting diode chip: step 4, filling silica gel in a gap between the light emitting diode chip and a glass ball cavity, performing anode bonding on the glass lens wafer and the silicon wafer carried with the light emitting diode chip to realize air-tightness encapsulation. The invention can realize white light emitting diode with even light intensity and has high emission rate of light rays; the encapsulation glass lens realizes the collimation of the light beam; the encapsulating reliability is very good; and the effective working time of the light emitting device is greatly prolonged.

Description

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Claims

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Application Information

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Owner SOUTHEAST UNIV
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