Semiconductor device and method for manufacturing the same
A manufacturing method and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems that it is difficult to fill the substrate and semiconductor chip space with a sealed body, increase the viscosity of the sealed body, etc., to achieve Reduced manufacturing cost, easy to manufacture
Inactive Publication Date: 2011-01-05
RENESAS ELECTRONICS CORP
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Problems solved by technology
However, if the inorganic filler is included too much, the viscosity of the sealing body increases, and then it becomes difficult to fill the space between the substrate and the semiconductor chip with the sealing body
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[0023] Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the accompanying drawings. Note that the exemplary embodiments are simplified for convenience. Since all the drawings are simplified, the technical scope of the present invention should not be limitedly interpreted based on the description of the drawings. The drawings are used as a whole for explanation of technical issues and each element shown in the drawings does not reflect the precise size of each element. The same reference numerals denote the same components in the drawings, and repeated explanations thereof are appropriately omitted for clarity of explanation.
[0024] Such as figure 1 As shown in , in a semiconductor device 1 , a wiring layer (substrate) 2 is connected to a semiconductor chip 3 by flip-chip bonding through bumps (connection portions) 4 . The wiring layer 2 and the semiconductor chip 3 are arranged with a space in between...
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The invention provides a semiconductor device and method for manufacturing the same. A semiconductor device includes a wiring layer, a semiconductor chip which is arranged on the wiring layer with a gap there between, the semiconductor chip being electrically connected to the wiring layer through a connecting portion, a first sealing member which is filled in a space between the wiring layer and the semiconductor chip, and a second sealing member which coats the semiconductor chip. The first sealing member and the second sealing member include same organic resin, the organic resin including inorganic filler. The second sealing member has larger content of inorganic filler than the first sealing member.
Description
[0001] incorporated by reference [0002] This application is based on and claims the benefit of priority from Japanese Patent Application No. 2009-153374 filed on Jun. 29, 2009, the contents of which are hereby incorporated by reference in their entirety. technical field [0003] The present invention relates to semiconductor devices and methods for manufacturing semiconductor devices. Background technique [0004] In flip-chip type semiconductor devices, the substrate is connected to the semiconductor chip by bumps. In such a semiconductor device, a sealing body is filled between a substrate and a semiconductor chip by using a so-called "capillary flow technique". The sealing body protects the connection between the substrate and the semiconductor chip. At this time, the sealing body includes an inorganic filler to completely protect the connection between the substrate and the semiconductor chip. However, if the inorganic filler is included too much, the viscosity of t...
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IPC IPC(8): H01L23/24H01L23/29H01L21/54H01L21/56
CPCH01L2224/83104H01L2224/73203H01L21/563H01L2224/81193H01L23/3128H01L23/295H01L2224/73204H01L2224/16227H01L2224/16225H01L2924/12044H01L2224/32225H01L2924/00014H01L2224/92125H01L2924/00H01L2224/0401
Inventor 木村雄大栗田洋一郎
Owner RENESAS ELECTRONICS CORP