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Device and method for processing substrates having large surface areas

A processing device and surface area technology, applied in auxiliary devices, metal processing equipment, manufacturing tools, etc., can solve the problems of volume increase, complex and expensive devices, transparent glass plate thickness, etc., and achieve the effect of high-precision processing

Inactive Publication Date: 2011-01-05
IWORKS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, this device has the disadvantage that relatively heavy substrates need to be moved during processing, which leads to a) increased bulk of the processing device and requires long linear axes and b) high substrate quality resulting in high Acceleration forces, leading to errors and / or requiring additional devices to counteract acceleration forces, thus complicating and costing the device
This arrangement has the disadvantage that the transparent glass sheet becomes very thick, especially in substrates with a large In the case of non-transparent bearings, the majority of the usable surface of the substrate is not accessible for processing, but independent laser lines can only be generated between the bearing arrangements

Method used

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  • Device and method for processing substrates having large surface areas
  • Device and method for processing substrates having large surface areas
  • Device and method for processing substrates having large surface areas

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Embodiment Construction

[0032] Such as figure 1 As shown, the prior art processing device for processing a large, flat substrate 11 from the backside comprises a table 13 having a narrow slot 15 into which processing devices can be attached. During processing, the substrate moves on the table in the direction of the vertical axis (arrow 17) and the laser device processes in the direction of the horizontal axis (arrow 19).

[0033] Such as figure 2 As shown, the device according to the present invention for processing large and flat substrates 11 from the back side comprises a plurality of linear bearing devices 21, 23, 25 for the substrates, which can pass directly through the substrates from the back side between the substrates. between processing. The machining device can be moved in the direction of the transverse axis (arrow 27 ) and the direction of the longitudinal axis (arrow 29 ) in respective regions between the two bearing arrangements. The substrate 11 is supported on a plurality of si...

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Abstract

A device for processing a usable surface extending on a usable side of a substrate (11) having a large surface area, particularly such having a length or width > 0.5 m and a thickness < 1 cm, through the substrate, has at least three bearing elements (21, 23, 25) disposed at a distance from each other for receiving the substrate (11), and a movable processing device for processing the substrate between the bearing elements from the rear of the substrate. The bearings support the substrate, and processing of the glass substrate can be carried out in the at least two intermediate regions between the bearing elements from the rear. At least one non-terminal bearing element is disposed displaceable or movable relative to the substrate in order to make the entire usable surface of the substrate accessible to the processing device by displacement or movement.

Description

technical field [0001] The present invention relates to an apparatus and method for processing the usable surface of substrates of large surface area, in particular substrates having a length or width of more than 0.5 meters and a thickness of less than 1 centimeter, comprising at least three Bearing means for the substrate arranged apart from each other and a movable processing means for processing the usable surface of the substrate between the bearing means. Background technique [0002] For processing large-area, flat substrates, processing from the upper usable side is preferred, since the substrate can then be placed horizontally on a base and then processed using a suitable processing device such as With laser jetting, the substrate is processed from above in the transverse and longitudinal directions over the entire usable area. [0003] However, for some processing procedures it is more advantageous to process from the rear side of the glass. Thus, for example, la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K37/04B23K26/08B23K26/00H01L31/18
CPCB23K26/0084B23K26/0876B23K37/0461B23K26/355
Inventor 阿瑟·布成尔
Owner IWORKS