Substrate processing equipment and thimble lifting device thereof

Abstract

The invention discloses a thimble lifting device used for substrate processing equipment, comprising a fixation seat supporting a thimble; a positioning rod penetrates through the middle part of the fixation seat along the vertical direction; a radial clearance is arranged between the positioning rod and the fixation seat; the tail end of the positioning rod is fixedly connected with a corrugatedpipe assembly; the fixation seat is evenly provided with two through holes with inner threads along a circumferential direction; a regulation screw is matched with the through hole through the thread; the lower end of the regulation screw is supported on the upper surface of the corrugated pipe assembly, thus the device can be leveled only by adjusting the regulation screw; the levelling process is simple and convenient, thus effectively shortening mean maintenance time of the device, improving the levelling range of the device, lowering the requirements of the processing and assembling precision of each component in the device, and saving the production cost. The invention also discloses the substrate processing equipment.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a thimble lifting device. The present invention also relates to a substrate processing equipment comprising the above ejector pin lifting device. Background technique [0002] With the rapid development of my country's economic construction, the market demand for semiconductor components is increasing, which has led to the rapid development of the semiconductor processing industry. [0003] At present, the interior of the process chamber for processing semiconductors generally has an electrostatic chuck, which is used to support semiconductor components such as crystals to be processed, and its lower part is provided with a lifting device. Thimble, the number of thimbles is generally four. When processing crystals, the transfer platform transfers the crystals into the process chamber, and makes the crystals a certain distance above the upper surface of the electrostatic ...

AI Technical Summary

Problems solved by technology

However, the adjustment range of the first adjustment screw 183 and the second adjustment screw 184 is relatively small. If the adjustment range is exceeded, the horizontal adjustment cannot be realized, which increases the processing and assembly precision requirements of each part and increases the processing and assembly costs. Difficulty; and, after replacing a certain part in the device, it is necessary to re-level the whole device, which increases the average maintenance time; in addition, the device is located in the lower part of the reaction chamber, with a metal box outside, and the whole device needs to be leveled during leveling. Dismantling, time-consuming and labor-intensive

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