Heat abstractor

Abstract

The invention discloses a heat abstractor comprising a heat pipe, a first cooling fin group and a second cooling fin group, wherein the first cooling fin group is provided with a first cooling fin adjacent to the second cooling fin group; the second cooling fin group is provided with a second cooling fin adjacent to the first cooling fin group; the height of the first cooling fin group is different from the height of the second cooling fin group; and one of the bodies of the first cooling fin and the second cooling fin is provided with a boss which leans against the other body of the first cooling fin and the second cooling fin. Compared with the prior art, the heat abstractor of the invention is characterized in that the boss of the first cooling fin leans against the body of the second cooling fin to prevent the second cooling fin from being embedded into the first sag of the first cooling fin, thus, the overall length of the first cooling fin group and the second cooling fin group does not decrease, which conforms to the safety specification of a laptop and lowers the reject ratio of the finished product.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for heat dissipation of electronic components. Background technique [0002] Existing heat dissipation devices generally include a heat absorbing plate, a heat pipe, and a heat dissipation fin group formed by stacking heat dissipation fins. Heat, and transfer the heat to the heat pipe, through the heat pipe to the cooling fin group, the heat is dissipated by the cooling fin group. [0003] Considering the internal structure design of the notebook computer, the heat dissipation fin group is often split into a first heat dissipation fin group and a second heat dissipation fin group which are adjacent and have different heights. Due to the difference in height, the first heat dissipation fin set and the second heat dissipation fin set tend to overlap during assembly, resulting in a reduction in the overall length of the heat dissipation fin set and an increase ...

AI Technical Summary

Problems solved by technology

Due to the difference in height, the first heat dissipation fin set and the second heat dissipation fin set tend to overlap during assembly, resulting in a reduction in the overall length of the heat dissipation fin set and an increase in the gap between the heat dissipation fin set and other components of the notebook computer. Does not meet laptop safety regulations

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