Continuous compound molding method of copper-aluminum composite board and compound molding device thereof

Abstract

The invention discloses a continuous compound molding method of a copper-aluminum composite board. In the method, aluminum blank is extruded into a plate-like one by a set of compound molding device and subjected to plastic deformation to form an aluminum board substrate; the aluminum board substrate and a copper board are combined and rolled to form a copper-aluminum composite structure; and the copper-aluminum composite structure is crimped and straightened to form a composite board or strip. The compound molding device comprises a rotary extrusion roll as well as an aluminum substrate forming die and a rolling roll which are arranged around the extrusion roll along the feeding direction; the aluminum substrate forming die is provided with an inward-concave cylindrical surface opposite to and spaced from the outer circumferential surface of the extrusion roll; the inward-concave cylindrical surface is consistent with the axial direction of the extrusion roll; the inward-concave cylindrical surface has a bending arc section in the feeding direction, and the space between the outer circumferential surface of the extrusion roll and the bending arc section is gradually reduced; a deformation area which drives the aluminum material to generate plastic deformation is formed between the bending arc section and the outer circumferential surface of the extrusion roll; and the rolling roll is assembled between the outlet of the deformation area and the outer circumferential surface of the extrusion roll to form a rolling area.

Description

technical field [0001] The invention relates to a composite forming technology of continuous extrusion and crimping, in particular to a manufacturing method of a copper-aluminum composite plate and a matching forming device. Background technique [0002] Metal copper has good electrical conductivity, thermal conductivity, corrosion resistance and antibacterial properties, so it is widely used. However, copper resources in my country are relatively short and the price is relatively high. However, my country's aluminum resources are relatively rich, the density of aluminum is low, and the price is cheap. It has become a good copper substitute material in many fields. However, the electrical and thermal conductivity of aluminum is not as good as that of copper, and its welding, arc extinguishing, and wear resistance are also poor. Therefore, in some applications, such as switches, heat sinks, and transition plates, it is difficult to directly replace copper with aluminum. At p...

AI Technical Summary

Problems solved by technology

[0007] Another object of the present invention is to provide a composite forming device that can prepare aluminum-copper composite materials through continuous extrusion and welding combined processes, so as to solve the problems of complex production process and high cost of copper-aluminum composite panels in the prior art

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