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Method for manufacturing multilayer printed circuit board

A technology for printed circuit boards and circuit layers, which is applied in multilayer circuit manufacturing, circuit, semiconductor/solid-state device manufacturing, etc. It can solve the problems of inability to make design changes and increase the cost of multilayer printed circuit boards, and achieve flexible design , saving development costs, and flexible manufacturing processes

Inactive Publication Date: 2013-03-20
SAMSUNG ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the circuit of a certain layer of the multilayer printed circuit board is changed, the PCB needs to be remanufactured, thus increasing the cost of the multilayer printed circuit board
Moreover, design changes cannot be made after PCB production is complete

Method used

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  • Method for manufacturing multilayer printed circuit board
  • Method for manufacturing multilayer printed circuit board
  • Method for manufacturing multilayer printed circuit board

Examples

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Embodiment Construction

[0026] Now, embodiments of the present invention will be described in detail, and embodiments of the present invention are shown in the accompanying drawings. In the drawings, the size and relative sizes of layers may be exaggerated for clarity. In the drawings, the same or similar reference numerals denote the same elements throughout.

[0027] According to the invention, the underlying printed circuit board and one or more circuit layers each having an adhesive layer are prefabricated, and then the one or more circuit layers are bonded layer by layer on the underlying printed circuit board via respective adhesive layers. board to form a multilayer printed circuit board. In the present invention, pads are also provided in the through holes of each circuit layer of the multilayer printed circuit board, so that each circuit layer is electrically connected to the chip to be packaged through the leads on the pads.

[0028] Hereinafter, a method of manufacturing a multilayer pri...

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PUM

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Abstract

The invention provides a method for manufacturing a multilayer printed circuit board (PCB), which comprises the following steps of: providing a bottom PCB layer; providing one or more than one circuit layers, wherein each circuit layer is provided with a bonding layer; bonding the one or more than one circuit layers to the bottom PCB layer one by one through respective bonding layer so as to obtain the multilayer PCB. The method for manufacturing the multilayer PCB can simplify manufacturing process, shorten process time and save development cost.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a method for manufacturing a multilayer printed circuit board. Background technique [0002] At present, the development of electronic devices tends to be small, thin, multi-functional and digital, and electronic components are also correspondingly developing in the direction of thinning, lead-out spacing and lead width, such as ball grid array (BGA) and other device packaging forms It is more popular, forcing the continuous updating of multilayer printed circuit technology to meet the needs of high-density assembly. Printed circuit board (PCB) is an important raw material for packaging, and the technology of manufacturing multilayer printed circuit boards has also attracted much attention. [0003] Generally, in order to manufacture a multilayer printed circuit board, different circuit boards are etched to form wiring layers, and then laminated to form a multilayer printe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H01L21/48
CPCH01L24/49H01L2224/32225H01L2224/48095H01L2224/48227H01L2224/48228H01L2224/48471H01L2224/49H01L2224/49109H01L2224/73265H01L2924/181H01L2924/1815H01L2924/00012
Inventor 黄玉财
Owner SAMSUNG ELECTRONICS CO LTD