Manufacturing method of flexible printed circuit board post-procedures

Abstract

The invention provides a manufacturing method of flexible printed circuit board post-procedures, comprising the following steps: cropping and blanking low-viscosity protective films according to the specification of flexible printed circuit boards to be subject to outline machining; carrying out outline machining on the front sections of the flexible printed circuit boards to be subject to outline machining; attaching the low-viscosity protective film 1 on one surface of each flexible printed circuit board, and carrying out outline machining on the rear sections of the flexible printed circuit boards; attaching the low-viscosity protective film 2 on the other surface of each flexible printed circuit board; removing the low-viscosity protective film 1 and waste on board surfaces, and keeping the single-piece boards stuck on the low-viscosity protective film 2; attaching steel sheets, film switches, gummed paper and other auxiliary materials; and finally attaching the low-viscosity protective film 3, and carrying out conventional finished product inspection to complete the manufacturing of the flexible printed circuit board post-procedures. In the invention, during the double outline machining period, the products are not lost, thus avoiding unnecessary loss; and the products are packaged with the low-viscosity protective films and are arranged regularly, thus facilitating statistics, lowering cost, reducing defects such as product friction and the like during the transfer process, and lowering transportation cost.

Description

technical field [0001] The invention relates to a method for manufacturing a flexible circuit board, in particular to a method for manufacturing a flexible circuit board in a subsequent process. Background technique [0002] With the miniaturization and lightweight development of various electronic devices, the flexible circuit boards used are also developing in this direction. In the production process of flexible circuit boards, especially in the punching, manual, packaging, inspection and other processes of the post-process, special care and careful operation are required. [0003] Such as figure 1 and cooperate figure 2 As shown, at present, the usual manufacturing method of the post-process of the flexible circuit board: the flexible circuit board is to be processed in the shape, punched into a single-piece product, and then pasted with steel sheets, membrane switches, adhesive tape and other auxiliary materials, and then inspected , packed in trays 10. [0004] Ho...

AI Technical Summary

Problems solved by technology

[0004] However, in this production method, especially in the subsequent processes of die-cutting, attaching auxiliary materials, packaging, and inspection, the placement of single-chip products is messy, and the production and statistics of single-chip products are quite troublesome. In the process of transferring single-chip products, it will cause unnecessary losses such as product wrinkles and product loss.

The shape of the flexible circuit board is irregular. The shape of the tray used for different products needs to be designed according to the shape of the product, which cannot be used universally. The packaging cost is high and more solid waste is generated.

In addition, pallets take up more space, virtually occupying transportation space and increasing transportation costs

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